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Technical Papers

2015
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2005
Application
Date Title Conference
2010-12-06 Deep trench module optimization for a more robust technology with reduced defect density at lower cost. ARCSIS - Rousset, France
2010-12-06 Diagnostics and troubleshooting of high density plasma process issue causing MIM-Capacitors electrical failures occurred in an automotive ASIC ARCSIS - Rousset, France
2010-12-06 Deep trench module optimization for a more robust technology with reduced defect density at lower cost ARCSIS - Rousset, France
2010-12-06 Development and advantages of an integrated technology monitor. ARCSIS - Rousset, France
2010-12-06 Development and advantages of an integrated technology monitor ARCSIS - Rousset, France
2010-12-06 Residual Stress of Thin Films of Polycrystalline and Amorphous Silicon Development of Materials Science in Research and Education
2010-12-06 Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages EuroSimE conference
2010-12-06 Design Solutions for Preventing Process Induced ESD Damage during Manufacturing of Interconnects ICICDT 2010 grenoble France
2010-12-06 Simulation of Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis IMAPS 2010 ,Raleigh Convention Center - Research Triangle, North Carolina
2010-12-06 Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire Bonds IMAPS/Research Triangle, North Carolina
2010-12-06 New VDMOS Structure with Discontinuous Thick Inter-Body Oxide to Reduce Gate-to-Drain Charge ISPSD 2010 (Hiroshima)
2010-12-06 Laser scribing on SOI wafer Journal of Applied Physics
2010-12-06 STRESS IN THIN FILMS OF POLYCRYSTALLINE SILICON SILICON 2010 / Roznov p. Radhostem, Czech Republic