製品変更通知
| Change Notification # |
|
20889B |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
WLP fab site change from Gunma, Japan to Niigata, Japan |
| Issue Date |
|
2015-06-04 |
| Affected Product Family |
|
|
| Description |
|
To continuously supply products and increase our supply capacity to support increased demand, the Wafer level package location will move from Gunma, Japan to Niigata, Japan. Most equipment and personnel will be transferred from the Gunma to the Niigata site. The Niigata site is ISO/TS16949 certified. Neither change in electrical characteristics, nor product reliably is expected.
|
| Key Items Affected by Change |
|
Manufacturing Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2016-02-15 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Makoto.Nakaoka@onsemi.com |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|