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Part Number = MC74ACT540

製品変更通知#

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20029 1Q2013 Product Discontinuance Notice 2013-04-18 PRODUCT DISCONTINUANCE View PDF
16582 Update to FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel) - FPCN16582 (SOIC Package) and FPCN16582A (TSSOP Package) 2012-07-13 UPDATE NOTIFICATION View PDF
16582B Final Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel). 2012-03-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16582A Final Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel). 2012-02-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16582 Final Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel) 2011-12-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16606 1Q11 (1st QUARTER 2011) Product Discontinuance Notice 2011-04-08 PRODUCT DISCONTINUANCE View PDF
16582 Initial Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel). 2011-03-16 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16569 4Q10 Product Discontinuance Notice 2011-01-24 PRODUCT DISCONTINUANCE View PDF
16570 Shipping Tube change for SOIC Wide Body (SOIC WB) devices at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16218 TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm 2009-02-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
15667 Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-10-31 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15333 Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL 2006-02-01 UPDATE NOTIFICATION View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
14235 Marking Type Change from Ink to Laser at ASECL 2005-07-29 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12434 Standard Components Low Sales Devices Product Discontinuance 2002-05-09 PRODUCT DISCONTINUANCE View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11137 1st Quarter 2001 Product Discontinuance Notification 2001-04-02 PRODUCT DISCONTINUANCE View PDF
10111 Traceability Code Correction for PB 10100 2000-01-10 PRODUCT BULLETIN View PDF
10100 Date Code Format Change for MFP(SO EIAJ T2) 1999-12-19 PRODUCT BULLETIN View PDF
10101 End of Life of Sticky Tape and Reel for MFP(SO EIAJ T2) Products (L1/L2/R1/R2) 1999-12-19 PRODUCT DISCONTINUANCE View PDF
10104 Emboss Tape and Reel Material Change for MFP(SO EIAJ T2)/TSSOP Products 1999-12-19 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4887 14/16/20L TSSOP 3-Layer Pre-Plated Frames 1999-07-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4423 TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4419 MFP14/16/20,LQFP32(7X7) Assembly and Test Site Transfer to Motorola Taiwan 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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