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Part Number = MC74HC175A

製品変更通知#

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20848 Capacity expansion for TSSOP14/16 Products into ASE Kunshan, China. 2015-05-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20029 1Q2013 Product Discontinuance Notice 2013-04-18 PRODUCT DISCONTINUANCE View PDF
16784 4Q2011 Product Discontinuance Notice 2012-01-27 PRODUCT DISCONTINUANCE View PDF
16622A Capacity expansion for SOIC14-16 Copper Wire Products into ASE Kunshan, China 2011-12-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16606 Retraction of Leaded Device list from PD16606 2011-04-26 UPDATE NOTIFICATION View PDF
16606 1Q11 (1st QUARTER 2011) Product Discontinuance Notice 2011-04-08 PRODUCT DISCONTINUANCE View PDF
16622 Initial notice of intent to qualify ASE Kunshan for SOIC 14/16 capacity expansion 2011-04-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16569 4Q10 Product Discontinuance Notice 2011-01-24 PRODUCT DISCONTINUANCE View PDF
16300 Final Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing From ON Semiconductor Piestany (Slovakia) To Tower Semiconductor Ltd. (Israel) 2009-07-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16218 TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm 2009-02-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16178 Initial Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing from ON Semiconductor Piestany (Slovakia) to Tower Semiconductor Israel. 2008-12-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16022 Use of winged type crimp design + rib for TSSOP4.4mm shipping tubes 2007-07-26 PRODUCT BULLETIN View PDF
15532 45 DAYS TO ORDER DEVICES LISTED IN PRODUCT DISCONTINUANCE NOTICE 15180 2006-05-15 UPDATE NOTIFICATION View PDF
15511 FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN 2006-04-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12274 Final Notification Of High Speed Logic Family Migration 2002-06-17 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12467 Update Notice for #12434: Standard Components Low Sales Devices Product Discontinuance 2002-06-12 UPDATE NOTIFICATION View PDF
12434 Standard Components Low Sales Devices Product Discontinuance 2002-05-09 PRODUCT DISCONTINUANCE View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11137 1st Quarter 2001 Product Discontinuance Notification 2001-04-02 PRODUCT DISCONTINUANCE View PDF
10272 High Speed CMOS Conversion of ILD to BPSG 2000-09-22 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4887 14/16/20L TSSOP 3-Layer Pre-Plated Frames 1999-07-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4423 TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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