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Part Number = MC74HCT574A

製品変更通知#

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20029 1Q2013 Product Discontinuance Notice 2013-04-18 PRODUCT DISCONTINUANCE View PDF
16569 4Q10 Product Discontinuance Notice 2011-01-24 PRODUCT DISCONTINUANCE View PDF
16570 Shipping Tube change for SOIC Wide Body (SOIC WB) devices at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16300 Final Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing From ON Semiconductor Piestany (Slovakia) To Tower Semiconductor Ltd. (Israel) 2009-07-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16218 TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm 2009-02-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
16178 Initial Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing from ON Semiconductor Piestany (Slovakia) to Tower Semiconductor Israel. 2008-12-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
15667 Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-10-31 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15333 Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL 2006-02-01 UPDATE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
14235 Marking Type Change from Ink to Laser at ASECL 2005-07-29 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12274 Final Notification Of High Speed Logic Family Migration 2002-06-17 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12434 Standard Components Low Sales Devices Product Discontinuance 2002-05-09 PRODUCT DISCONTINUANCE View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11527 Update Notice (Cancellation) For PCN#11096: High Speed Logic Family Migration 2001-07-18 UPDATE NOTIFICATION View PDF
11137 1st Quarter 2001 Product Discontinuance Notification 2001-04-02 PRODUCT DISCONTINUANCE View PDF
11096 Intital Notification of High Speed Logic Family Migration 2001-03-24 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10111 Traceability Code Correction for PB 10100 2000-01-10 PRODUCT BULLETIN View PDF
10100 Date Code Format Change for MFP(SO EIAJ T2) 1999-12-19 PRODUCT BULLETIN View PDF
10104 Emboss Tape and Reel Material Change for MFP(SO EIAJ T2)/TSSOP Products 1999-12-19 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4887 14/16/20L TSSOP 3-Layer Pre-Plated Frames 1999-07-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4423 TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4419 MFP14/16/20,LQFP32(7X7) Assembly and Test Site Transfer to Motorola Taiwan 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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