製品変更通知
| Change Notification # |
|
20498 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Cover Tape Material Change from Heat Seal to Cold Seal for Die Sales Products |
| Issue Date |
|
2014-07-03 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is pleased to announce the qualification of Cold Seal cover tape (3M part number UCT 2688A) for die sales products sold in Tape and Reel. Currently, these products are shipped in Tape and Reel with Heat Seal cover tape. This change is being made as part of ON Semiconductor’s ongoing quality optimization efforts. The change to Cold Seal cover tape reduces the risk of die sticking to the cover tape.
|
| Key Items Affected by Change |
|
Packing |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-10-03 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|