製品変更通知
| Change Notification # |
|
16007 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
FPCN for Qualification of QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness |
| Issue Date |
|
2007-04-06 |
| Affected Product Family |
|
|
| Description |
|
Upon expiration of this FPCN, all QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness devices and all WDFN/WQFN 0.75MM Package Thickness (1.2x1.0MM to 8.0x8.0MM) devices will be sourced from both the Seremban facility and the existing facility (UTAC, located in Bangkok,
Thailand).
|
| Key Items Affected by Change |
|
Package thickness |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-06-06 |
| Sample Info: |
|
contact local sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|