製品変更通知
| Change Notification # |
|
16686 |
| Revision |
|
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Polyimide Passivation on PowerMOS Devices |
| Issue Date |
|
2011-07-25 |
| Affected Product Family |
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| Description |
|
This Final Process Change Notification (FPCN) is being issued for Power MOSFET products.
ON Semiconductor is presenting this notification for their customers to announce a wafer process change on their Trench3 silicon platform. For SO8 Flat Lead and Micro8 Flat Lead products, there will be a change with the Trench3 Die passivation scheme from a Teos-Silicon Nitride to a Polyimide.
There will be no Electrical, Switching, and Dynamic performance difference. All Qualification and Reliability testing has been completed, and has passed all the required criteria.
|
| Key Items Affected by Change |
|
Power MOSFET Business Unit: Wafer Fabrication |
| |
| Key Milestones |
|
| Effective Date: |
|
2011-10-25 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office Brian Goodburn |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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