製品変更通知
| Change Notification # |
|
10148 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
HYSOL Molding Compound and AFW(American Fine Wire) Change |
| Issue Date |
|
2000-03-17 |
| Affected Product Family |
|
DISCRETES AND LOGIC |
| Description |
|
SMP, an ON Semiconductor's QS9002 qualified joint-venture in Malaysia, wants to qualify second source suppliers for mold compound and bonding wire to ensure the smooth flow of production/delivery. ON Semiconductor does not anticipate any impact on quality or delivery to customers. This change may potentially apply to all of the devices in the following packages: SOT23, SC59, SC74, SC70, SC88, SC75.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2000-06-25 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office. |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|