製品変更通知
| Change Notification # |
|
11507 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Final Notification for Assembly/Test Site Capacity Addition for Broadband Products in the SOIC-8 Package |
| Issue Date |
|
2001-08-27 |
| Affected Product Family |
|
BROADBAND |
| Description |
|
ON Semiconductor is pleased to announce that it has successfully completed qualification of the ON Semiconductor Philippines Incorporated (OSPI) facility located in Carmona, Philippines to assemble and test selected Broadband products in SOIC-8 packages. Currently, Broadband SOIC-8 packages are assembled and tested at Advanced Semiconductor Engineering (ASE-CL) in ChungLi, Taiwan.
|
| Key Items Affected by Change |
|
Assembly/Test Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2001-10-27 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|