製品変更通知
| Change Notification # |
|
13998 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of NCP300_301_302 and 303 on ACMOS2 Technology Platform |
| Issue Date |
|
2005-03-25 |
| Affected Product Family |
|
ANALOG |
| Description |
|
This is the Final Product Change Notification (follow up to IPCN 13535) to make customers aware of the qualification of NCP300, NCP301, NCP302 and NCP303 series of Voltage Detector products on the ACMOS2 Technology Platform from the current ACMOS1 Technology Platform for the benefit of increased capacity. Die fabrication will continue at the current wafer fab site, ON Semiconductor MOS7A, in Aizu, Japan.
|
| Key Items Affected by Change |
|
Die Shrink |
| |
| Key Milestones |
|
| Effective Date: |
|
2005-05-25 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|