製品変更通知
| Change Notification # |
|
15335 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Initial Notification of Qualification of OSPI for Assembly/Test of 8/14/16 Lead SOIC Narrow Packages |
| Issue Date |
|
2006-02-08 |
| Affected Product Family |
|
ANALOG |
| Description |
|
Initial Process Change Notice to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 8/14/16 lead narrow SOIC packages.
|
| Key Items Affected by Change |
|
Assembly & Test Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2006-06-08 |
| Sample Info: |
|
Contact local Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|