製品変更通知
| Change Notification # |
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15676 |
| Revision |
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| Type of Notification |
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INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Initial PCN for Qualification of UQFN / UDFN / LLGA 0.5mm package thickness 1x1mm to 3x3mm) at ON Seremban |
| Issue Date |
|
2006-12-06 |
| Affected Product Family |
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ANALOG AND DISCRETES |
| Description |
|
This is the initial PCN announcing qualification of the ON Semiconductor facility located in Seremban, Malaysia as an additional assembly location for the 0.5mm thickness UQFN / UDFN / LLGA packages.
Seremban is currently a qualified site for the assembly and test of 0.9mm thickness QFN / DFN packages. There will be no changes in device functionality, case outline, or footprint. Reliability will continue to meet or exceed ON Semiconductors highest standards.
Final product change notifications will be released with the completion of reliability testing. Upon expiration of the Final PCN, 0.5mm UDFN / UQFN / LLGA devices will be sourced from both the Seremban facility and the existing facility (UTAC, located in Bangkok, Thailand). Any new devices released after publication of the FPCN for a specific package style/die size will be qualified for assembly in both locations.
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| Key Items Affected by Change |
|
ON Semiconductor Assembly Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-04-06 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Todd Manes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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