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製品変更通知

Change Notification #   15676
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Initial PCN for Qualification of UQFN / UDFN / LLGA 0.5mm package thickness 1x1mm to 3x3mm) at ON Seremban
Issue Date   2006-12-06
Affected Product Family   ANALOG AND DISCRETES
Description   This is the initial PCN announcing qualification of the ON Semiconductor facility located in Seremban, Malaysia as an additional assembly location for the 0.5mm thickness UQFN / UDFN / LLGA packages. Seremban is currently a qualified site for the assembly and test of 0.9mm thickness QFN / DFN packages. There will be no changes in device functionality, case outline, or footprint. Reliability will continue to meet or exceed ON Semiconductor’s highest standards. Final product change notifications will be released with the completion of reliability testing. Upon expiration of the Final PCN, 0.5mm UDFN / UQFN / LLGA devices will be sourced from both the Seremban facility and the existing facility (UTAC, located in Bangkok, Thailand). Any new devices released after publication of the FPCN for a specific package style/die size will be qualified for assembly in both locations.
Key Items Affected by Change   ON Semiconductor Assembly Site
 
Key Milestones  
Effective Date:   2007-04-06
Sample Info:   Contact your local ON Semiconductor Sales Office or Todd Manes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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