製品変更通知
| Change Notification # |
|
15677 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Improvement of MSL for SOT223 (discrete) |
| Issue Date |
|
2006-12-07 |
| Affected Product Family |
|
DISCRETES |
| Description |
|
This is an Initial Product Change Notification to make customers aware that ON Semiconductor is qualifying a new BOM with a different lead frame, die attach epoxy and mold compound that will improve the moisture sensitivity level (MSL) for the SOT223 discrete package.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-04-07 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|