製品変更通知
| Change Notification # |
|
16041 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
DPAK Package Mold Compound Change |
| Issue Date |
|
2007-08-30 |
| Affected Product Family |
|
|
| Description |
|
As a part of ON Semiconductors continuous improvement programs, the mold compound for the Dpak package assembled at the ON Semiconductor factory located at Seremban, Malaysia, will be changing. The same supplier of the existing compound will be used but the formulation will be modified for improved reliability in terms of moisture testing and delamination (SAT) performance.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-12-30 |
| Sample Info: |
|
Contact your local ON Semiconductor sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|