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製品変更通知

Change Notification #   16116
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for Devices Currently Fabricated at XFAB Wafer Foundries
Issue Date   2008-05-13
Affected Product Family  
Description   ON Semiconductor is pleased to announce a capacity expansion qualification for devices currently fabricated at the XFAB wafer foundries. Products currently qualified at the XFAB wafer foundry facilities (located in Erfurt, Germany and Lubbock, Texas) will now also be qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration of the associated Final PCN(s), devices may be supplied from either the XFAB foundries or the Gresham fab. The Gresham wafer fab is ISO9001:2000 compliant. The products currently run on XFAB’s 0.6um BiCMOS process. Devices will be qualified to run at Gresham on the 0.25um “ONC25” process. Device performance will be the same among the qualified facilities for each device family. All devices will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this foundry expansion qualification.
Key Items Affected by Change   ON Semi Fab Site / Subcontractor Fab Site
 
Key Milestones  
Effective Date:   2008-09-13
Sample Info:   Contact your local ON semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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