製品変更通知
| Change Notification # |
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16486 |
| Revision |
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| Type of Notification |
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PRODUCT BULLETIN |
| Change Title |
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DPAK Package Case Outline Standardization to match JEDEC and Industry |
| Issue Date |
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2010-06-09 |
| Affected Product Family |
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| Description |
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ON Semiconductor is updating our DPAK Package case outlines to follow the JEDEC TO-252 Solid State Product Outline dimensional methodology. There will be NO Change to any materials, processes, or physical dimensions in the manufacturing of the package, this is only a change to specifications dimensional methodology of the case outline. This updating of the package case outline does not affect the form/fit/function of devices as no changes to products are occurring.
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| Key Items Affected by Change |
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| Key Milestones |
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| Effective Date: |
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2010-06-09 |
| Sample Info: |
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| Possible Replacements |
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N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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