製品変更通知
| Change Notification # |
|
16710 |
| Revision |
|
A |
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Copper wire bond for Micro 8 package in Seremban, Malaysia – FPCN Cancelled |
| Issue Date |
|
2012-02-29 |
| Affected Product Family |
|
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| Description |
|
The FPCN16710 was originally released on 1 Sept 2011 with an expiration date of 5-Dec-2011. This FPCN is now cancelled and the Micro 8 package will remain on the Gold Wire bond process. At some time in the future, a new FPCN may be issued to continue with this change.
|
| Key Items Affected by Change |
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| |
| Key Milestones |
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| Effective Date: |
|
2012-02-29 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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