製品変更通知
| Change Notification # |
|
16855 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
VHVIC 2nd Source Qualification to Gresham FAB – Phase 3 |
| Issue Date |
|
2012-06-05 |
| Affected Product Family |
|
|
| Description |
|
The CHANGED PART IDENTIFICATION: section of the previously released FPCN16855 should have read:
Affected products with date code WW33-2012 and greater may be sourced from either Gresham or Aizu wafer Fabrication site.
This aligns with the proposed first ship date listed on page 1 of the FPCN.
Part number NCP1605BDR2G was inadvertently omitted from the previous FPCN and is now added as part of this change notification.
Part numbers NCP1030DMR2G, NCP1031DR2G and NCP1031MNTXG were included in FPCN16855, but had previously been released under FPCN16773 and should be covered under that FPCN.
|
| Key Items Affected by Change |
|
Wafer FAB location |
| |
| Key Milestones |
|
| Effective Date: |
|
2012-08-11 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|