製品変更通知
| Change Notification # |
|
16441 |
| Revision |
|
C |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
NCP1406 Qualification at Gresham Wafer Fab |
| Issue Date |
|
2012-09-28 |
| Affected Product Family |
|
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| Description |
|
ON Semiconductor is pleased to announce a wafer fab transfer qualification for the NCP1406.
This device is currently qualified at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan and is now qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab.
The Gresham wafer fab is compliant to ISO9001:2008, ISO/TS16949:2009, and ISO14001:2004.
The NCP1406 currently run on the Aizu ACMOS2 process. The same ACMOS2 process has been transferred to and successfully qualified at the Gresham wafer fab. No device design changes have been made. Device performance is the same for Aizu and Gresham-sourced devices.
The NCP1406 will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this fab qualification.
|
| Key Items Affected by Change |
|
Wafer Fab Location |
| |
| Key Milestones |
|
| Effective Date: |
|
2013-01-07 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Mathew.Hilton@onsemi.com |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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