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製品変更通知

Change Notification #   16441
Revision   C
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   NCP1406 Qualification at Gresham Wafer Fab
Issue Date   2012-09-28
Affected Product Family  
Description   ON Semiconductor is pleased to announce a wafer fab transfer qualification for the NCP1406. This device is currently qualified at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan and is now qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab. The Gresham wafer fab is compliant to ISO9001:2008, ISO/TS16949:2009, and ISO14001:2004. The NCP1406 currently run on the Aizu ACMOS2 process. The same ACMOS2 process has been transferred to and successfully qualified at the Gresham wafer fab. No device design changes have been made. Device performance is the same for Aizu and Gresham-sourced devices. The NCP1406 will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this fab qualification.
Key Items Affected by Change   Wafer Fab Location
 
Key Milestones  
Effective Date:   2013-01-07
Sample Info:   Contact your local ON Semiconductor Sales Office or Mathew.Hilton@onsemi.com
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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