製品変更通知
| Change Notification # |
|
16939 |
| Revision |
|
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of T1 FET die, used in NCP34x & NCP37x devices, at UMC Wafer Fab |
| Issue Date |
|
2012-11-17 |
| Affected Product Family |
|
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| Description |
|
ON Semiconductor is pleased to announce the qualification for the FET die, utilized in the NCP34x and NCP37x family of devices, in United Microelectronics Corp (UMC) Wafer Fab.
The FET for the NCP34x and NCP37x is currently qualified at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan and is now qualified at UMC’s wafer fabrication facility located in Taiwan. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab.
|
| Key Items Affected by Change |
|
Silicon Fabrication Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2013-02-17 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Shilpa.Rao@onsemi.com |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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