製品変更通知
| Change Notification # |
|
20640 |
| Revision |
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
NCP6343 Wafer Probe ATE Qualification at UTAC and CSP Bump Qualification at FCI. |
| Issue Date |
|
2014-09-15 |
| Affected Product Family |
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| Description |
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This PCN is to notify ON Semiconductor’s customer’s that the NCP6343 family of devices are now qualified at UTAC (Singapore) for ATE wafer probing and CSP bumping at FCI (Phoenix, AZ, USA).
The affected devices listed on this PCN are currently bumped at Deca (Philippines) and ATE wafer probed at ON Semiconductor Seremban, Malaysia facility (SBN). Upon expiration of this FPCN, or early customer approval, these devices may be processed at either Deca or FCI for CSP wafer bumping and SBN or UTAC for ATE wafer probing
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| Key Items Affected by Change |
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Assembly Site |
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| Key Milestones |
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| Effective Date: |
|
2015-01-05 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Mat Hilton |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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