製品説明
This device is optimized for fast low side switching applications. It features a technology that provides a balance between low gate charge and low R
DS(on)
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特長 |
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Planar Technology Device Offers Low RDS(on) and Fast Switching Speed
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Leadless ChipFET™ Package has 40% Smaller Footprint than TSOP-6. Ideal Device Applications Where Board Space is at a Premium.
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ChipFET™ Package Exhibits Excellent Thermal Capabilities. Ideal for Applications Where Heat Transfer is Required.
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Pb-Free Package Option for Green Manufacturing.
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Pb-Free Package is Available
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アプリケーション |
- DC-DC Buck or Boost Converters
- Low Side Switching
- Optimized for Battery and Low Side Switching Applications in Computing and Portable Equipment
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