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11.9 Entire Agreement; Amendment; Counterparts; Facsimile Copies. This Agreement, including the Exhibits attached hereto, constitutes the entire agreement and understanding between the parties hereto regarding the subject matter hereof and supersedes all other agreements, understandings, promises, representations or discussions, written or oral, between the parties regarding the subject matter hereof. This Agreement may not be amended except in writing signed by an authorized representative of each of the parties hereto. This Agreement may be executed in counterparts, each of which shall be deemed to be an original, and which together shall constitute one and the same agreement. Each party hereto may deliver an executed copy of this Agreement to the other party via facsimile or other electronic means, and such executed copy(ies) sent/received via facsimile or other electronic means shall be deemed an original and binding copy.

12. Confidentiality. Notwithstanding any terms to the contrary in any non-disclosure agreements between the Parties, Licensee shall treat this Agreement and the Content as ON Semiconductor's "Confidential Information" including: not using the Confidential Information except as expressly set forth herein or otherwise authorized in writing; implementing reasonable procedures to prohibit the disclosure, unauthorized duplication, misuse or removal of the Confidential Information; and not disclosing the Confidential Information to any third party except as may be necessary and required in connection with the rights and obligations under this Agreement and subject to confidentiality obligations at least as protective as those set forth herein, or as otherwise required by law. It is expressly understood that all Confidential Information transferred hereunder, and all copies, modifications, and derivatives thereof, will remain the property of ON Semiconductor, and the Licensee is authorized to use those materials only in accordance with the terms and conditions of this Agreement. Upon termination of this Agreement or upon written request, License shall either return all Confidential Information to ON Semiconductor along with all copies and/or derivatives made, including that on computer databases and copies of portions of the Confidential Information, or destroy all such Confidential Information and certify by written memorandum that all such Confidential Information has been destroyed.

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FAQ

Pbフリー(鉛フリー)に関してよく尋ねられる質問

鉛フリー・プロセスへの移行が進んでいる要因は何ですか?

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オン・セミコンダクターは、お客様の地球環境基準への適合に対するご要望の高まりに対応できるよう、鉛フリー化を進めています。錫/鉛 (SnPb) 半田は、その利便性、経済性、および電気的、機械的特性のために、電気的接続に広く使用されてきました。近年になって、鉛(Pb)に関する環境問題が取り上げられるようになった結果、半導体業界では鉛フリー半導体の必要性に対する注目が高まってきました。世界各国で次々と、半導体の有害物質含有量の取り締まりを強化する法律が制定されています。このような法律の制定が、半導体業界で環境に優しい製品の開発を促進する要因となっています。

オン・セミコンダクターの「鉛フリー」の定義は何ですか?

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RoHS指令に従うと、鉛の最大濃度値は重量パーセントで1000 ppmすなわち0.1%です。主に鉛フリーの外部リード仕上げ/メッキへの取り組みが行われてきました。

Does your company have a roadmap for Pb-free development?

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オン・セミコンダクターは鉛フリーの外部メッキ処理製品に転換しました。量産数量で鉛フリー製品のサポートを受けるには、現地販売代理店を通してリクエストを提出していただく必要があります。これは、当社のメッキ処理能力を調整し、鉛フリー製品の製造を万全にサポートするために必要な情報を当社に提供していただくためです。

製品の供給状況、認定タイム・スケジュールの詳細を説明してください。

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オン・セミコンダクターは全製品について鉛フリー・メッキへの適合性を認定し、量産向けにリリースしています。

260℃高温リフロー・アセンブリ工程を経たオン・セミコンダクターの「鉛フリー」デバイスに対して、信頼性を証明するためにどんな認定試験が実施されますか?

[ページトップへ]

鉛フリー・リード・メッキの認定:

鉛フリー・デバイスには、どのようなメッキ仕上げが使用されますか?

[ページトップへ]

自社製造施設では、

下請けアセンブリ施設では、

フェーズ・スケジュールで鉛フリー・デバイスに転換する予定がない場合、購入するデバイスを継続してSnPb仕上げで受け取ることができますか?その期間は?

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オン・セミコンダクターは積極的に、鉛フリー環境への転換を進めています。現時点で製造プロセスを転換できないお客様は、販売担当者にご要望をお知らせください。

鉛フリー・デバイスに移行するのに追加費用がかかりますか?鉛フリー・パッケージは鉛含有パッケージよりコストが高くなりますか?

[ページトップへ]

現在のところ、オン・セミコンダクターは鉛含有デバイスと同等な価格で鉛フリー・デバイスを提供しています。

在庫品または入庫品について、どのような方法で鉛含有製品と鉛フリー製品を識別できますか?

[ページトップへ]

中間コンテナのラベル – リール、チューブ、その他のプライマリ・コンテナのラベルには、JEDEC規格JESD97に従って鉛フリー・ロゴ、2LIが印刷されます。

中間ボックスのラベル:中間ボックスにも、上記と同じ鉛フリー表記である鉛フリー・ロゴ、2LIが貼付されるため、在庫製品が鉛フリーかどうかを容易に識別できます。

現在単独で提供されている鉛フリー仕上げの既存パッケージについては、現行の製品番号に"G"サフィックスを追加して、鉛含有製品と鉛フリー製品を区別しています。これは、鉛フリーかつ鉛フリー・ボード実装アセンブリ処理への適合性が認定されている製品を明確に識別することを目的としています。Gサフィックスのない製品番号の鉛フリー・デバイスを受け取っているお客様にGサフィックス製品への変更をお願いすることはありません。

現在鉛含有リード仕上げで提供されているパッケージについては、新しいオン・セミコンダクタ製品番号の下でデバイスの鉛フリー・バージョンが提供される予定です。新しい製品番号は通常、既存の鉛含有製品番号に"G"サフィックスを付加して、デバイスの鉛フリー・リード仕上げおよび鉛フリー・ボード実装アセンブリ処理への適合性認定を示します。

鉛フリー製品は固有の製品マーキングでも識別可能です。スペースが許す限り、鉛フリー・パッケージには製品番号の後ろに「G」の文字が付けられます。文字を入れるスペースがない場合は、マイクロドットが使用されます。

鉛フリー・パッケージ、注文、サンプルのリクエストはどのように行いますか?

[ページトップへ]

鉛フリー製品およびそのサンプルをご注文の際は、販売代理店またはカスタマ・サービス代理店に直接ご連絡いただくか、オンライン・ウェブ・サービスからリクエストしてください。

100%錫メッキ仕上げの場合、錫ウィスカのリスクを評価するのにどのような認定プロセスが使用されていますか?

[ページトップへ]

オン・セミコンダクターは、錫ウィスカに関してNEMI/JEITA/JEDEC規定の試験を実施してきました。

結論:

詳細については、当社の錫ウィスカ・テクニカル・ノート ( ) を参照してください。

なぜ錫100%には従来からウィスカ成長問題がありますか?

[ページトップへ]

100%錫メッキは、低コストの鉛フリー・メッキに対する下位互換ソリューションです。ウィスカはリスクですが業界データは、その危険性がきわめて低いことを示しています。

この転換後もオン・セミコンダクターの製品には鉛が含有されますか?

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オン・セミコンダクター製品の一部には依然としてダイ・アタッチに鉛(Pb)が含まれます。これはRoHS規制に基づいて許可されます。

製品に含有される環境に優しくないその他の化合物を減らすためのオン・セミコンダクターの計画は何ですか?

[ページトップへ]

世界各国で次々と、半導体の有害物質含有量の取り締まりを強化する法律が制定されています。このような法律の制定が、半導体業界で環境に優しい製品の開発を促進する要因となっています。オン・セミコンダクターは、お客様の地球環境基準への適合に対する要望の高まりに対応できるよう努力いたします。

鉛フリー・デバイスを使用するのに、顧客側の工程ではどのような変更が必要ですか?

[ページトップへ]

変更は必要ありません。

公表された鉛フリー化スケジュールに従って、鉛フリー・バージョンがリリースされた後も鉛含有製品を使用し続けるにはどうしたらよいでしょうか?

[ページトップへ]

オン・セミコンダクターはSnPb(錫鉛)メッキ製品から転換しています。現時点で製造プロセスを転換できないお客様は、販売担当者にご要望をお知らせください。

鉛フリー部品はSnPb半田ペーストに適合しますか?

[ページトップへ]

純粋なSnおよびNiPdAuは、SnPb半田ペーストと上位/下位互換性があります。

注文時に鉛含有製品と鉛フリー製品の違いを区別するには?鉛フリー製品には別の製品番号が使用されますか?

[ページトップへ]

はい。鉛フリー製品の製品番号には「G」サフィックスが付けられています。

パーツのマーキングは変更されますか?

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鉛フリー製品は固有の製品マーキングでも識別可能です。スペースが許す限り、鉛フリー・パッケージには製品番号の後ろに「G」の文字が付けられます。文字を入れるスペースがない場合は、マイクロドットが使用されます。

サンプル注文が鉛フリーかどうかを知る方法は?

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鉛フリー製品には、リール、チューブ、またはレール、および中間ボックスのバー・コード・ラベルに、鉛フリー・ロゴ、2LIが印刷される予定です。

鉛フリー・パッケージの品質基準と信頼性基準は、既存パッケージと異なりますか?

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SMDの場合は、ハンダ付け性の検証に加えて、リフロー温度260℃ +5/-0℃における湿度感度レベル(MSL)の再分類が必要です。MSLの再分類は、パッケージで使用される最大ダイ・サイズで実行されます。実施する試験には通常、以下の項目が含まれます。

既存のSnPb製品はすべて260℃のリフロー温度に耐えますか?

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現在のところ、当社製デバイスの大半はSnPbメッキで260℃に耐えると考えられます。当社は260℃におけるMSLレベルの分類を進めております。

鉛フリーで260℃のリフロー温度に適合する製品を識別する方法は?

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パッケージはすべて、JEDEC規格J-STD-020Cに準拠する260℃+5/-0℃リフロー・プロファイルで認定されます。リール、チューブ、またはレール、および中間ボックスに貼付されたバー・コード・ラベルには、鉛フリー・ロゴ、2LIが印刷される予定です。

お客様からの質問を受け付ける担当者は誰ですか?

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オン・セミコンダクターの鉛フリー・リード・メッキ戦略に関する詳細情報は、代理店および販売店にお問い合わせください。

オン・セミコンダクターの製品含有化学物質情報の最新版を入手するには?

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この資料は当社のリファレンス・マニュアルのエリアからダウンロードできます。
製品含有化学物質ブローシャ - BRD8022/D ( )

オン・セミコンダクターのデータシートを参照して、鉛フリー・デバイスを確認できますか?

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オン・セミコンダクターは、鉛フリー製品を反映するためにすべてのデータ・シートの更新作業を行っています。必要なデータ・シートがまだ更新されていない場合は、優先サービスに関して販売代理店にお問い合わせください。データ・シートはリクエストを受け取ってから24時間以内に提供できます。

鉛フリー化はデバイスのMSL定格に影響を与えますか? 違いは何ですか?

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MSL(湿度感度レベル)定格は、バー・コード・ラベル上に表示されます。パッケージのMSL定格が変更された場合、オン・セミコンダクターから適切な梱包を施した製品が出荷されます。オン・セミコンダクターの大部分のパッケージでは、現行の260℃+5/-0℃でのMSL定格は以前の235℃+5/-0℃での定格と同じです。