Webinar: ON Semiconductor Transfer-Molded Power Integrated Modules (TM-PIM) for Industrial Motor Drive Applications


Date and Time

Date: June 24, 2020

Time: 10:00 AM CT

This webinar will be presented in Chinese


Register


Abstract

The TM-PIM module adopts advanced transfer molding process, integrates the best IGBT / FRD technology to provide higher output power, higher power density and higher reliability than ordinary gel-filled power modules. It conforms to IEC and UL standards, suitable for industrial drives, servos and commercial air conditioners with a wide power range. This webinar will introduce the features, process, structure, topology, product roadmap, standard and certification of our TMPIM, as well as the advantages over competitive devices and appliances.


Speaker

Dr. Jinchang Zhou, ON Semiconductor Package Development Engineer

Dr. Zhou Jinchang is a packaging development engineer of ON Semiconductor High Power Devices Division, responsible for power module design and new product development. He received a Ph.D. from the University of Arkansas.

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