| 20774Z |
Henkel Green Compound Qual for SC88, SC88A, SC70, SC74, SC75, SOD923 pkgs |
2015-03-04 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 20425Z |
SOD-123 package/devices qualification for assembly & test in Leshan, China |
2015-01-07 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 20425 |
Final Notification of SOD-123 package/devices qualification for assembly & test in Leshan, China |
2014-08-29 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 20425A |
Final Notification of SOD-123 package/devices qualification for assembly & test in Leshan, China |
2014-08-29 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16837 |
1Q2012 – Update Notice for the reactivation of previously discontinued parts |
2012-04-02 |
UPDATE NOTIFICATION |
View
PDF |
| 16673 |
2Q11 (2nd QUARTER 2011) Product Discontinuance Notice |
2011-06-30 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16583 |
1Q2011 – Update Notice for the reactivation of previously discontinued parts |
2011-04-08 |
UPDATE NOTIFICATION |
View
PDF |
| 16547O |
Copper Wire replacing Gold Wire in the SOT563, SOT553, SOT223(Soft Solder), SOD323, SC88, SC89, SOT723, SOD923, SOT963, SOT953 and SOT1123 packages |
2010-12-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16538 |
Special Leaded Product Discontinuance Notice |
2010-11-23 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16498 |
2Q10 2nd QUARTER 2010 Product Discontinuance Notice |
2010-07-07 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16469 |
Initial Notification for SOD123 assembly in ON Leshan as 2nd source |
2010-05-26 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16478O |
Copper Wire replacing Gold Wire in the SOT23, SC88/SC88A, SC70, SC74, SC75, SOD123, SOD523, SOD723, SOT723, SOD923 Packages. |
2010-05-19 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16452 |
1Q10 Product Discontinuance Notice |
2010-04-14 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16389 |
4Q09 (4th QUARTER 2009) Product Discontinuance Notice |
2010-01-21 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16350 |
Final Notification for Transfer of Small Signal Schottky and Bidirectional ESD Diodes from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) |
2009-11-02 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16352 |
Copper Wire replacing Gold Wire in the SOT23, SC59, SC70, SC74, SC75 and SC88 Packages |
2009-10-29 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16266 |
Copper Wire replacing Gold Wire in the SOT23, SOD123, SOD323, TSOP6, SOT223, and SC88/SC88A Packages |
2009-06-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16250 |
Initial Notification of Transfer of EMI Filters, Bidirectional ESD Diodes, Bipolar Power, Bidirectional TVS (Transient Voltage Suppressor) Diodes, TVS (Transient Voltage Suppressor) Arrays, Small Signal Schottky, Ultrafast Rectifier and Thyristor Surge Protection Devices (TSPD) products from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) |
2009-04-29 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16134 |
SOT-23 Possible Adhesion Issue using Glue Mount Process |
2008-07-11 |
PRODUCT BULLETIN |
View
PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16004 |
H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2007-06-27 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 15694 |
4Q06 Product Discontinuance Notice |
2007-01-02 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 15645 |
3rd QUARTER 2006 Product Discontinuance Notice |
2006-10-06 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 15590 |
2Q06 (2nd QUARTER 2006) Product Discontinuance Notice |
2006-06-30 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 15573 |
Final Notification for manufacturing expansion to Leshan China for the SC74 & SC75 packages |
2006-06-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15503 |
1QO6 (1st QUARTER 2006) Product Discontinuance Notice |
2006-04-12 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 15314 |
Initial Notification of the manufacturing expansion to Leshan, China for the SC74 & SC75 packages |
2006-02-03 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15006 |
Intrinsic Lead (Pb) Free Product Part Number Change |
2005-08-30 |
PRODUCT BULLETIN |
View
PDF |
| 13248 |
Lead Free Products Marking Identification |
2003-12-05 |
PRODUCT BULLETIN |
View
PDF |
| 12898 |
Qualification of Additional Assembly/Test Site for ON Semiconductor Devices Packaged in SC70 |
2003-07-11 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 12287 |
Final Notification for Small Signal Schottky Process Consolidation in Zener Rectifier Wafer Fab |
2003-06-24 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 12926 |
MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-05-27 |
UPDATE NOTIFICATION |
View
PDF |
| 12797 |
PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-04-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10216 |
SOT23 Assembly/Test Transfer to LPS |
2000-07-31 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10148 |
HYSOL Molding Compound and AFW(American Fine Wire) Change |
2000-03-17 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 4952 |
SOD-123 Silver Strip Leadframe Elimination |
1999-07-30 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |