| 20425 |
Final Notification of SOD-123 package/devices qualification for assembly & test in Leshan, China |
2014-08-29 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 20233 |
Change SOD123-FL Package Maximum Height |
2013-09-13 |
PRODUCT BULLETIN |
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PDF |
| 16538 |
Special Leaded Product Discontinuance Notice |
2010-11-23 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16478O |
Copper Wire replacing Gold Wire in the SOT23, SC88/SC88A, SC70, SC74, SC75, SOD123, SOD523, SOD723, SOT723, SOD923 Packages. |
2010-05-19 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16452 |
1Q10 Product Discontinuance Notice |
2010-04-14 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16266 |
Copper Wire replacing Gold Wire in the SOT23, SOD123, SOD323, TSOP6, SOT223, and SC88/SC88A Packages |
2009-06-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16105 |
ISMF Wafer Fab Qualification for Schottky Rectifier Products |
2008-03-17 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
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PDF |
| 15006 |
Intrinsic Lead (Pb) Free Product Part Number Change |
2005-08-30 |
PRODUCT BULLETIN |
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PDF |
| 13428 |
Phase 2 Qualification of Schottky Rectifier Wafer Production in LiON Microelectronics, LLC |
2004-04-13 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13248 |
Lead Free Products Marking Identification |
2003-12-05 |
PRODUCT BULLETIN |
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PDF |
| 13211 |
Qualification of Schottky Rectifier Wafer Production in LiON Microelectronics, LLC. |
2003-11-20 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 12926 |
MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-05-27 |
UPDATE NOTIFICATION |
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PDF |
| 12797 |
PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-04-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12687 |
Schottky Die Shrinks |
2003-01-31 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 12402 |
1Q02 (1ST QTR/2002) Product Discontinuance |
2002-04-16 |
PRODUCT DISCONTINUANCE |
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PDF |
| 12384 |
Qualification of DO-41 Package Outline in place of DO-15 Package Outline |
2002-03-19 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12108 |
Update Annoucement for Qualfication of Liteon Seefull Assembly/Test Site for Axial Leaded Product |
2001-12-11 |
UPDATE NOTIFICATION |
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PDF |
| 11696 |
2nd Update to 10570: Non Active Area Die Shrink for Schottky Rectifiers |
2001-08-31 |
UPDATE NOTIFICATION |
View
PDF |
| 11694 |
Update to 10570: Non Active Area Die Shrink for Schottky Rectifiers |
2001-08-23 |
UPDATE NOTIFICATION |
View
PDF |
| 11499 |
Final Notification for Qualfication of Liteon Seefull Assembly/Test Site for Axial Leaded Product |
2001-08-15 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 11248 |
Initial Notice: Additional Die Metalization Qualification for Schottky Rectifiers |
2001-04-03 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10570 |
Non Active Area Die Shrink for Schottky Rectifiers |
2001-01-22 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10048 |
Schottky Rectifiers Qualification of Guadalajara, Mexico Wafer Fab |
1999-09-30 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 4602 |
Update to 4591 - Sector Materials Org. (SMO) Closure (Part 3 of 8) |
1999-04-14 |
UPDATE NOTIFICATION |
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PDF |
| 4591 |
Sector Materials Organization (SMO) Closure (Part 3 of 8) |
1999-04-05 |
PRODUCT BULLETIN |
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PDF |