| 20082 |
Copper wire bond for IC Micro 8 package |
2013-05-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16710A |
Copper wire bond for Micro 8 package in Seremban, Malaysia – FPCN Cancelled |
2012-02-29 |
UPDATE NOTIFICATION |
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PDF |
| 16727 |
Copper Wire for SOIC and TSSOP packages in Carmona, Philippines |
2011-09-22 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16710 |
Copper wire bond for Micro 8 package in Seremban, Malaysia |
2011-09-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16571 |
Shipping Tube change for SOIC Narrow Body (SOIC NB) devices and QSOP at ON Semiconductor Carmona, Philippines |
2011-01-19 |
PRODUCT BULLETIN |
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PDF |
| 16212 |
Move of IC T092 Assembly and Test to Dalian, China |
2009-02-05 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16112 |
Move of IC T092 Assembly and Test to Dalian, China |
2008-04-10 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16052 |
Product Discontinuance Notice - T092 Pb Lead Finish |
2007-09-26 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16004 |
H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2007-06-27 |
PRODUCT DISCONTINUANCE |
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PDF |
| 15505 |
Update to 15339: Initial notice of intent to qualify Hana Semi for Micro08, Micro10, and TSOP5 capacity expansion |
2006-04-06 |
UPDATE NOTIFICATION |
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PDF |
| 15339 |
Initial notice of intent to qualify Hana Semiconductor for Micro08, Micro10, and TSOP5 capacity expansion |
2006-03-28 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15212 |
Pb-free Conversion - Backward Compatibility |
2005-12-28 |
GENERAL ANNOUNCEMENT |
View
PDF |
| 15019 |
Device Marking Update/Standardization - TSOP5 Analog IC Package |
2005-09-16 |
PRODUCT BULLETIN |
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PDF |
| 12926 |
MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-05-27 |
UPDATE NOTIFICATION |
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PDF |
| 12797 |
PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-04-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 10185 |
Update to PCN#10105: Micro 8 Package Material |
2000-06-05 |
UPDATE NOTIFICATION |
View
PDF |
| 10152 |
Update Notification for PCN10130 |
2000-03-15 |
UPDATE NOTIFICATION |
View
PDF |
| 10147 |
Update Notification for PCNs 4813 and 10041 |
2000-03-08 |
UPDATE NOTIFICATION |
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PDF |
| 10130 |
Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual |
2000-02-02 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 10105 |
Qualification of MICRO8 Package at ON Semi Seremban Location |
1999-12-22 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 10041 |
Transfer from BMC/BP4 to Tesla of Analog EPI82, 85, 92 Devices |
1999-09-29 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |