PCN 検索結果
Part Number = NCV33064
| 20082 |
Copper wire bond for IC Micro 8 package |
2013-05-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16710A |
Copper wire bond for Micro 8 package in Seremban, Malaysia – FPCN Cancelled |
2012-02-29 |
UPDATE NOTIFICATION |
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PDF |
| 16727 |
Copper Wire for SOIC and TSSOP packages in Carmona, Philippines |
2011-09-22 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16710 |
Copper wire bond for Micro 8 package in Seremban, Malaysia |
2011-09-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16212 |
Move of IC T092 Assembly and Test to Dalian, China |
2009-02-05 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16112 |
Move of IC T092 Assembly and Test to Dalian, China |
2008-04-10 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16004 |
H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2007-06-27 |
PRODUCT DISCONTINUANCE |
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PDF |
| 15212 |
Pb-free Conversion - Backward Compatibility |
2005-12-28 |
GENERAL ANNOUNCEMENT |
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PDF |
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