| 20948X |
Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia |
2015-07-10 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 20109 |
2Q2013 Product Discontinuance Notice |
2013-07-23 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16218 |
TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm |
2009-02-17 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16022 |
Use of winged type crimp design + rib for TSSOP4.4mm shipping tubes |
2007-07-26 |
PRODUCT BULLETIN |
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PDF |
| 15174 |
Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban |
2005-12-14 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15021 |
Update Notification for QFN Assembly at NSEB |
2005-09-19 |
UPDATE NOTIFICATION |
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PDF |
| 15006 |
Intrinsic Lead (Pb) Free Product Part Number Change |
2005-08-30 |
PRODUCT BULLETIN |
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PDF |
| 13751 |
Final PCN for Qualification of QFN (3.3MM TO 8X8MM, 6 TO 52-LD) at ASAT China |
2004-12-02 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13826 |
Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products |
2004-11-29 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13716 |
Initial PCN for Qualification of QFN (2X2.2MM TO 8X8MM, 6 TO 52-LD) at ASAT China |
2004-10-22 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13706 |
Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products |
2004-10-19 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13432 |
Addition of ON Seremban as Assembly Site for 3X3 QFN Logic Products |
2004-04-13 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13368 |
Qualification of 3X3 QFN (QUAD FLAT NO-LEAD) Package at NSEB |
2004-03-12 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13296 |
Initial PCN for Qualification of QFN (2X2.2MM to 8X8MM, 6 to 52LD) at ON Seremban |
2004-01-21 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13270 |
Initial PCN for Qualification of QFN (QUAD FLAT NO-LEAD) (2X2.2MM to 8X8MM, 6 to 52LD) at NSEB |
2003-12-16 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13248 |
Lead Free Products Marking Identification |
2003-12-05 |
PRODUCT BULLETIN |
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PDF |
| 13157 |
Addition of Tower Fab for Minigate, LCX, VHC, FST and Analog Switch Products |
2003-10-31 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12514 |
Update Notice for FPCN #12313 - Addition of Tower Semiconductor as a Qualified Wafer Fabrication Site |
2002-08-12 |
UPDATE NOTIFICATION |
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PDF |
| 12048 |
Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification |
2002-01-11 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |