Altium

Design Rule Verification Report

Date: 2024-01-15
Time: ¿ÀÈÄ 3:59:39
Elapsed Time: 00:00:01
Filename: C:\Users\zbdwng\OneDrive - onsemi\zbdwng\zbdwng\Altium\NCP51152EVB_220429\NCP51152EVB TO247_3L_240115\NCP51152EVB TO247_3L_240115.PcbDoc
Warnings: 0
Rule Violations: 193

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=0.254mm) (All),(All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Modified Polygon (Allow modified: No), (Allow shelved: No) 0
Width Constraint (Min=0.5mm) (Max=2mm) (Preferred=1mm) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All) 0
Hole Size Constraint (Min=0.3mm) (Max=3.5mm) (All) 0
Hole To Hole Clearance (Gap=0.254mm) (All),(All) 0
Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All) 15
Silk To Solder Mask (Clearance=0.254mm) (IsPad),(All) 157
Silk to Silk (Clearance=0.254mm) (All),(All) 20
Net Antennae (Tolerance=0mm) (All) 0
Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All) 1
Total 193

Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All)
Minimum Solder Mask Sliver Constraint: (0.129mm < 0.254mm) Between Pad C1-1(18.76mm,16.8mm) on Top Layer And Via (19.7mm,15.5mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.129mm]
Minimum Solder Mask Sliver Constraint: (0.141mm < 0.254mm) Between Pad C2-1(18.7mm,14.2mm) on Top Layer And Via (19.7mm,15.5mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.141mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Pad C3-1(18.4mm,23.4mm) on Top Layer And Via (18.3mm,24.9mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm]
Minimum Solder Mask Sliver Constraint: (0.156mm < 0.254mm) Between Pad C5-1(39.26mm,25.532mm) on Top Layer And Via (38.5mm,24.2mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.156mm]
Minimum Solder Mask Sliver Constraint: (0.224mm < 0.254mm) Between Pad C7-1(34.2mm,11.3mm) on Top Layer And Via (34.2mm,12.7mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.224mm]
Minimum Solder Mask Sliver Constraint: (0.249mm < 0.254mm) Between Pad R6-2(39.26mm,22.774mm) on Top Layer And Via (38.5mm,24.2mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.249mm]
Minimum Solder Mask Sliver Constraint: (0.057mm < 0.254mm) Between Pad U1-4(25.7mm,15.96mm) on Top Layer And Via (25.3mm,15.1mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.057mm]
Minimum Solder Mask Sliver Constraint: (0.057mm < 0.254mm) Between Pad U1-4(25.7mm,15.96mm) on Top Layer And Via (26.1mm,15.1mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.057mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Via (37.5mm,23.2mm) from Top Layer to Bottom Layer And Via (37.5mm,24.2mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm] / [Bottom Solder] Mask Sliver [0.197mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Via (37.5mm,23.2mm) from Top Layer to Bottom Layer And Via (38.5mm,23.2mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm] / [Bottom Solder] Mask Sliver [0.197mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Via (37.5mm,24.2mm) from Top Layer to Bottom Layer And Via (38.5mm,24.2mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm] / [Bottom Solder] Mask Sliver [0.197mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Via (37.5mm,25.3mm) from Top Layer to Bottom Layer And Via (38.5mm,25.3mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm] / [Bottom Solder] Mask Sliver [0.197mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Via (37.5mm,26.4mm) from Top Layer to Bottom Layer And Via (38.5mm,26.4mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm] / [Bottom Solder] Mask Sliver [0.197mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Via (37.5mm,27.5mm) from Top Layer to Bottom Layer And Via (38.5mm,27.5mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm] / [Bottom Solder] Mask Sliver [0.197mm]
Minimum Solder Mask Sliver Constraint: (0.197mm < 0.254mm) Between Via (38.5mm,23.2mm) from Top Layer to Bottom Layer And Via (38.5mm,24.2mm) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.197mm] / [Bottom Solder] Mask Sliver [0.197mm]
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Silk To Solder Mask (Clearance=0.254mm) (IsPad),(All)
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (14.9mm,14.4mm) on Top Overlay And Pad TP2-1(14.9mm,14.4mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (15.6mm,20.1mm) on Top Overlay And Pad TP1-1(15.6mm,20.1mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (24.8mm,9.9mm) on Top Overlay And Pad TP9-1(24.8mm,9.9mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (32.4mm,4.963mm) on Top Overlay And Pad TP6-1(32.4mm,4.963mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (34.5mm,30.1mm) on Top Overlay And Pad TP11-1(34.5mm,30.1mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (36.4mm,19.3mm) on Top Overlay And Pad TP5-1(36.4mm,19.3mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (39mm,11.3mm) on Top Overlay And Pad TP4-1(39mm,11.3mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (41.9mm,28.4mm) on Top Overlay And Pad TP10-1(41.9mm,28.4mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (42.7mm,11.2mm) on Top Overlay And Pad TP7-1(42.7mm,11.2mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (56.2mm,33.7mm) on Top Overlay And Pad TP3-1(56.2mm,33.7mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.173mm < 0.254mm) Between Arc (9.4mm,8.2mm) on Top Overlay And Pad TP8-1(9.4mm,8.2mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.173mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-1(40.2mm,34.1mm) on Top Layer And Track (39.159mm,29.934mm)(39.159mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-1(40.2mm,34.1mm) on Top Layer And Track (39.17mm,35.103mm)(39.946mm,35.103mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-1(40.2mm,34.1mm) on Top Layer And Track (40.465mm,35.103mm)(41.241mm,35.103mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-1(40.2mm,34.1mm) on Top Layer And Track (41.241mm,29.934mm)(41.241mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-2(40.2mm,30.925mm) on Top Layer And Track (39.159mm,29.922mm)(39.957mm,29.922mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-2(40.2mm,30.925mm) on Top Layer And Track (39.159mm,29.934mm)(39.159mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-2(40.2mm,30.925mm) on Top Layer And Track (40.429mm,29.922mm)(41.227mm,29.922mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C10-2(40.2mm,30.925mm) on Top Layer And Track (41.241mm,29.934mm)(41.241mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C1-1(18.76mm,16.8mm) on Top Layer And Track (17.693mm,15.835mm)(17.693mm,16.536mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C1-1(18.76mm,16.8mm) on Top Layer And Track (17.693mm,15.835mm)(22.34mm,15.835mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C1-1(18.76mm,16.8mm) on Top Layer And Track (17.693mm,17.044mm)(17.693mm,17.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C1-1(18.76mm,16.8mm) on Top Layer And Track (17.693mm,17.765mm)(22.34mm,17.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C1-2(21.3mm,16.8mm) on Top Layer And Track (17.693mm,15.835mm)(22.34mm,15.835mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C1-2(21.3mm,16.8mm) on Top Layer And Track (17.693mm,17.765mm)(22.34mm,17.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C1-2(21.3mm,16.8mm) on Top Layer And Track (22.34mm,15.835mm)(22.34mm,16.536mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C1-2(21.3mm,16.8mm) on Top Layer And Track (22.34mm,17.044mm)(22.34mm,17.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C2-1(18.7mm,14.2mm) on Top Layer And Track (17.633mm,13.235mm)(17.633mm,13.936mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C2-1(18.7mm,14.2mm) on Top Layer And Track (17.633mm,13.235mm)(22.28mm,13.235mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C2-1(18.7mm,14.2mm) on Top Layer And Track (17.633mm,14.444mm)(17.633mm,15.165mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C2-1(18.7mm,14.2mm) on Top Layer And Track (17.633mm,15.165mm)(22.28mm,15.165mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C2-2(21.24mm,14.2mm) on Top Layer And Track (17.633mm,13.235mm)(22.28mm,13.235mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C2-2(21.24mm,14.2mm) on Top Layer And Track (17.633mm,15.165mm)(22.28mm,15.165mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C2-2(21.24mm,14.2mm) on Top Layer And Track (22.28mm,13.235mm)(22.28mm,13.936mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C2-2(21.24mm,14.2mm) on Top Layer And Track (22.28mm,14.444mm)(22.28mm,15.165mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-1(18.4mm,23.4mm) on Top Layer And Track (17.397mm,22.37mm)(17.397mm,23.146mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-1(18.4mm,23.4mm) on Top Layer And Track (17.397mm,23.665mm)(17.397mm,24.441mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-1(18.4mm,23.4mm) on Top Layer And Track (17.409mm,22.359mm)(22.566mm,22.359mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-1(18.4mm,23.4mm) on Top Layer And Track (17.409mm,24.441mm)(22.566mm,24.441mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-2(21.575mm,23.4mm) on Top Layer And Track (17.409mm,22.359mm)(22.566mm,22.359mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-2(21.575mm,23.4mm) on Top Layer And Track (17.409mm,24.441mm)(22.566mm,24.441mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-2(21.575mm,23.4mm) on Top Layer And Track (22.578mm,22.359mm)(22.578mm,23.157mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C3-2(21.575mm,23.4mm) on Top Layer And Track (22.578mm,23.629mm)(22.578mm,24.427mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C4-1(18.8mm,20.6mm) on Top Layer And Track (17.733mm,19.635mm)(17.733mm,20.336mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C4-1(18.8mm,20.6mm) on Top Layer And Track (17.733mm,19.635mm)(22.38mm,19.635mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C4-1(18.8mm,20.6mm) on Top Layer And Track (17.733mm,20.844mm)(17.733mm,21.565mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C4-1(18.8mm,20.6mm) on Top Layer And Track (17.733mm,21.565mm)(22.38mm,21.565mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C4-2(21.34mm,20.6mm) on Top Layer And Track (17.733mm,19.635mm)(22.38mm,19.635mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C4-2(21.34mm,20.6mm) on Top Layer And Track (17.733mm,21.565mm)(22.38mm,21.565mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C4-2(21.34mm,20.6mm) on Top Layer And Track (22.38mm,19.635mm)(22.38mm,20.336mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C4-2(21.34mm,20.6mm) on Top Layer And Track (22.38mm,20.844mm)(22.38mm,21.565mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C5-1(39.26mm,25.532mm) on Top Layer And Track (38.193mm,24.567mm)(38.193mm,25.268mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C5-1(39.26mm,25.532mm) on Top Layer And Track (38.193mm,24.567mm)(42.84mm,24.567mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C5-1(39.26mm,25.532mm) on Top Layer And Track (38.193mm,25.776mm)(38.193mm,26.498mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C5-1(39.26mm,25.532mm) on Top Layer And Track (38.193mm,26.498mm)(42.84mm,26.498mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C5-2(41.8mm,25.532mm) on Top Layer And Track (38.193mm,24.567mm)(42.84mm,24.567mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C5-2(41.8mm,25.532mm) on Top Layer And Track (38.193mm,26.498mm)(42.84mm,26.498mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C5-2(41.8mm,25.532mm) on Top Layer And Track (42.84mm,24.567mm)(42.84mm,25.268mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C5-2(41.8mm,25.532mm) on Top Layer And Track (42.84mm,25.776mm)(42.84mm,26.497mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-1(34.8mm,8.4mm) on Top Layer And Track (30.634mm,7.359mm)(35.791mm,7.359mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-1(34.8mm,8.4mm) on Top Layer And Track (30.634mm,9.441mm)(35.791mm,9.441mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-1(34.8mm,8.4mm) on Top Layer And Track (35.803mm,7.359mm)(35.803mm,8.135mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-1(34.8mm,8.4mm) on Top Layer And Track (35.803mm,8.654mm)(35.803mm,9.43mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-2(31.625mm,8.4mm) on Top Layer And Track (30.622mm,7.373mm)(30.622mm,8.171mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-2(31.625mm,8.4mm) on Top Layer And Track (30.622mm,8.643mm)(30.622mm,9.441mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-2(31.625mm,8.4mm) on Top Layer And Track (30.634mm,7.359mm)(35.791mm,7.359mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C6-2(31.625mm,8.4mm) on Top Layer And Track (30.634mm,9.441mm)(35.791mm,9.441mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C7-1(34.2mm,11.3mm) on Top Layer And Track (30.62mm,10.335mm)(35.267mm,10.335mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C7-1(34.2mm,11.3mm) on Top Layer And Track (30.62mm,12.265mm)(35.267mm,12.265mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C7-1(34.2mm,11.3mm) on Top Layer And Track (35.267mm,10.335mm)(35.267mm,11.056mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C7-1(34.2mm,11.3mm) on Top Layer And Track (35.267mm,11.564mm)(35.267mm,12.265mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C7-2(31.66mm,11.3mm) on Top Layer And Track (30.62mm,10.335mm)(30.62mm,11.056mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C7-2(31.66mm,11.3mm) on Top Layer And Track (30.62mm,10.335mm)(35.267mm,10.335mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C7-2(31.66mm,11.3mm) on Top Layer And Track (30.62mm,11.564mm)(30.62mm,12.265mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C7-2(31.66mm,11.3mm) on Top Layer And Track (30.62mm,12.265mm)(35.267mm,12.265mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C8-1(31.3mm,24.4mm) on Top Layer And Track (30.233mm,23.435mm)(30.233mm,24.136mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C8-1(31.3mm,24.4mm) on Top Layer And Track (30.233mm,23.435mm)(34.88mm,23.435mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad C8-1(31.3mm,24.4mm) on Top Layer And Track (30.233mm,24.644mm)(30.233mm,25.365mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C8-1(31.3mm,24.4mm) on Top Layer And Track (30.233mm,25.365mm)(34.88mm,25.365mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C8-2(33.84mm,24.4mm) on Top Layer And Track (30.233mm,23.435mm)(34.88mm,23.435mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad C8-2(33.84mm,24.4mm) on Top Layer And Track (30.233mm,25.365mm)(34.88mm,25.365mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C8-2(33.84mm,24.4mm) on Top Layer And Track (34.88mm,23.435mm)(34.88mm,24.136mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.202mm < 0.254mm) Between Pad C8-2(33.84mm,24.4mm) on Top Layer And Track (34.88mm,24.644mm)(34.88mm,25.365mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.202mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-1(37.4mm,34.1mm) on Top Layer And Track (36.359mm,29.934mm)(36.359mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-1(37.4mm,34.1mm) on Top Layer And Track (36.37mm,35.103mm)(37.146mm,35.103mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-1(37.4mm,34.1mm) on Top Layer And Track (37.665mm,35.103mm)(38.441mm,35.103mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-1(37.4mm,34.1mm) on Top Layer And Track (38.441mm,29.934mm)(38.441mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-2(37.4mm,30.925mm) on Top Layer And Track (36.359mm,29.922mm)(37.157mm,29.922mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-2(37.4mm,30.925mm) on Top Layer And Track (36.359mm,29.934mm)(36.359mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-2(37.4mm,30.925mm) on Top Layer And Track (37.629mm,29.922mm)(38.427mm,29.922mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.165mm < 0.254mm) Between Pad C9-2(37.4mm,30.925mm) on Top Layer And Track (38.441mm,29.934mm)(38.441mm,35.091mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.165mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Pad D1-1(34.6mm,16.44mm) on Top Layer And Track (33.9mm,14.22mm)(33.9mm,17.12mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.195mm < 0.254mm) Between Pad D1-1(34.6mm,16.44mm) on Top Layer And Track (33.9mm,17.12mm)(35.3mm,17.12mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.195mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Pad D1-1(34.6mm,16.44mm) on Top Layer And Track (35.3mm,14.22mm)(35.3mm,17.12mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Pad D1-2(34.6mm,15.2mm) on Top Layer And Track (33.9mm,14.22mm)(33.9mm,17.12mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.195mm < 0.254mm) Between Pad D1-2(34.6mm,15.2mm) on Top Layer And Track (33.9mm,14.52mm)(35.3mm,14.52mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.195mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Pad D1-2(34.6mm,15.2mm) on Top Layer And Track (35.3mm,14.22mm)(35.3mm,17.12mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R1-1(11.3mm,21.2mm) on Top Layer And Track (10.335mm,20.159mm)(10.335mm,24.807mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R1-1(11.3mm,21.2mm) on Top Layer And Track (10.335mm,20.159mm)(12.291mm,20.159mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R1-1(11.3mm,21.2mm) on Top Layer And Track (12.291mm,20.159mm)(12.291mm,24.807mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R1-2(11.3mm,23.74mm) on Top Layer And Track (10.335mm,20.159mm)(10.335mm,24.807mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R1-2(11.3mm,23.74mm) on Top Layer And Track (10.335mm,24.807mm)(12.291mm,24.807mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R1-2(11.3mm,23.74mm) on Top Layer And Track (12.291mm,20.159mm)(12.291mm,24.807mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R2-1(11.3mm,15.16mm) on Top Layer And Track (10.335mm,14.119mm)(10.335mm,18.767mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R2-1(11.3mm,15.16mm) on Top Layer And Track (10.335mm,14.119mm)(12.291mm,14.119mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R2-1(11.3mm,15.16mm) on Top Layer And Track (12.291mm,14.119mm)(12.291mm,18.767mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R2-2(11.3mm,17.7mm) on Top Layer And Track (10.335mm,14.119mm)(10.335mm,18.767mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R2-2(11.3mm,17.7mm) on Top Layer And Track (10.335mm,18.767mm)(12.291mm,18.767mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R2-2(11.3mm,17.7mm) on Top Layer And Track (12.291mm,14.119mm)(12.291mm,18.767mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R3-1(41.8mm,20.016mm) on Top Layer And Track (38.193mm,19.051mm)(42.841mm,19.051mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R3-1(41.8mm,20.016mm) on Top Layer And Track (38.193mm,21.007mm)(42.841mm,21.007mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R3-1(41.8mm,20.016mm) on Top Layer And Track (42.841mm,19.051mm)(42.841mm,21.007mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R3-2(39.26mm,20.016mm) on Top Layer And Track (38.193mm,19.051mm)(38.193mm,21.007mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R3-2(39.26mm,20.016mm) on Top Layer And Track (38.193mm,19.051mm)(42.841mm,19.051mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R3-2(39.26mm,20.016mm) on Top Layer And Track (38.193mm,21.007mm)(42.841mm,21.007mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R4-1(41.84mm,14.5mm) on Top Layer And Track (38.233mm,13.535mm)(42.881mm,13.535mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R4-1(41.84mm,14.5mm) on Top Layer And Track (38.233mm,15.491mm)(42.881mm,15.491mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R4-1(41.84mm,14.5mm) on Top Layer And Track (42.881mm,13.535mm)(42.881mm,15.491mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R4-2(39.3mm,14.5mm) on Top Layer And Track (38.233mm,13.535mm)(38.233mm,15.491mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R4-2(39.3mm,14.5mm) on Top Layer And Track (38.233mm,13.535mm)(42.881mm,13.535mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R4-2(39.3mm,14.5mm) on Top Layer And Track (38.233mm,15.491mm)(42.881mm,15.491mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R5-1(41.8mm,17.258mm) on Top Layer And Track (38.193mm,16.293mm)(42.841mm,16.293mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R5-1(41.8mm,17.258mm) on Top Layer And Track (38.193mm,18.249mm)(42.841mm,18.249mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R5-1(41.8mm,17.258mm) on Top Layer And Track (42.841mm,16.293mm)(42.841mm,18.249mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R5-2(39.26mm,17.258mm) on Top Layer And Track (38.193mm,16.293mm)(38.193mm,18.249mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R5-2(39.26mm,17.258mm) on Top Layer And Track (38.193mm,16.293mm)(42.841mm,16.293mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R5-2(39.26mm,17.258mm) on Top Layer And Track (38.193mm,18.249mm)(42.841mm,18.249mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R6-1(41.8mm,22.774mm) on Top Layer And Track (38.193mm,21.809mm)(42.841mm,21.809mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R6-1(41.8mm,22.774mm) on Top Layer And Track (38.193mm,23.765mm)(42.841mm,23.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R6-1(41.8mm,22.774mm) on Top Layer And Track (42.841mm,21.809mm)(42.841mm,23.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R6-2(39.26mm,22.774mm) on Top Layer And Track (38.193mm,21.809mm)(38.193mm,23.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R6-2(39.26mm,22.774mm) on Top Layer And Track (38.193mm,21.809mm)(42.841mm,21.809mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R6-2(39.26mm,22.774mm) on Top Layer And Track (38.193mm,23.765mm)(42.841mm,23.765mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R7-1(33.7mm,21.64mm) on Top Layer And Track (32.709mm,18.033mm)(32.709mm,22.681mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R7-1(33.7mm,21.64mm) on Top Layer And Track (32.709mm,22.681mm)(34.665mm,22.681mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R7-1(33.7mm,21.64mm) on Top Layer And Track (34.665mm,18.033mm)(34.665mm,22.681mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R7-2(33.7mm,19.1mm) on Top Layer And Track (32.709mm,18.033mm)(32.709mm,22.681mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R7-2(33.7mm,19.1mm) on Top Layer And Track (32.709mm,18.033mm)(34.665mm,18.033mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R7-2(33.7mm,19.1mm) on Top Layer And Track (34.665mm,18.033mm)(34.665mm,22.681mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.203mm < 0.254mm) Between Pad R8-1(31.26mm,26.9mm) on Top Layer And Track (30.219mm,25.909mm)(30.219mm,27.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.203mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R8-1(31.26mm,26.9mm) on Top Layer And Track (30.219mm,25.909mm)(34.867mm,25.909mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R8-1(31.26mm,26.9mm) on Top Layer And Track (30.219mm,27.865mm)(34.867mm,27.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.241mm < 0.254mm) Between Pad R8-2(33.8mm,26.9mm) on Top Layer And Track (30.219mm,25.909mm)(34.867mm,25.909mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.241mm]
Silk To Solder Mask Clearance Constraint: (0.216mm < 0.254mm) Between Pad R8-2(33.8mm,26.9mm) on Top Layer And Track (30.219mm,27.865mm)(34.867mm,27.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.216mm]
Silk To Solder Mask Clearance Constraint: (0.229mm < 0.254mm) Between Pad R8-2(33.8mm,26.9mm) on Top Layer And Track (34.867mm,25.909mm)(34.867mm,27.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.229mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-1(25.7mm,19.77mm) on Top Layer And Track (24.915mm,19.135mm)(26.815mm,19.135mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-2(25.7mm,18.5mm) on Top Layer And Track (24.915mm,17.865mm)(26.815mm,17.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-2(25.7mm,18.5mm) on Top Layer And Track (24.915mm,19.135mm)(26.815mm,19.135mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-3(25.7mm,17.23mm) on Top Layer And Track (24.915mm,16.595mm)(26.815mm,16.595mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-3(25.7mm,17.23mm) on Top Layer And Track (24.915mm,17.865mm)(26.815mm,17.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-4(25.7mm,15.96mm) on Top Layer And Track (24.915mm,16.595mm)(26.815mm,16.595mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-5(31.1mm,15.96mm) on Top Layer And Track (29.915mm,16.595mm)(31.815mm,16.595mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-6(31.1mm,17.23mm) on Top Layer And Track (29.915mm,16.595mm)(31.815mm,16.595mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-6(31.1mm,17.23mm) on Top Layer And Track (29.915mm,17.865mm)(31.815mm,17.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-7(31.1mm,18.5mm) on Top Layer And Track (29.915mm,17.865mm)(31.815mm,17.865mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-7(31.1mm,18.5mm) on Top Layer And Track (29.915mm,19.135mm)(31.815mm,19.135mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
Silk To Solder Mask Clearance Constraint: (0.208mm < 0.254mm) Between Pad U1-8(31.1mm,19.77mm) on Top Layer And Track (29.915mm,19.135mm)(31.815mm,19.135mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.208mm]
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Silk to Silk (Clearance=0.254mm) (All),(All)
Silk To Silk Clearance Constraint: (0.191mm < 0.254mm) Between Arc (14.9mm,14.4mm) on Top Overlay And Text "INN" (13.9mm,16.1mm) on Top Overlay Silk Text to Silk Clearance [0.191mm]
Silk To Silk Clearance Constraint: (0.18mm < 0.254mm) Between Arc (15.6mm,20.1mm) on Top Overlay And Text "INP" (14.4mm,21.8mm) on Top Overlay Silk Text to Silk Clearance [0.18mm]
Silk To Silk Clearance Constraint: (0.199mm < 0.254mm) Between Arc (36.4mm,19.3mm) on Top Overlay And Text "OUTL" (34.9mm,21mm) on Top Overlay Silk Text to Silk Clearance [0.199mm]
Silk To Silk Clearance Constraint: (0.173mm < 0.254mm) Between Arc (41.9mm,28.4mm) on Top Overlay And Text "GND2" (43.6mm,27.7mm) on Top Overlay Silk Text to Silk Clearance [0.173mm]
Silk To Silk Clearance Constraint: (0.233mm < 0.254mm) Between Text "C6" (34mm,6.1mm) on Top Overlay And Track (30.634mm,7.359mm)(35.791mm,7.359mm) on Top Overlay Silk Text to Silk Clearance [0.233mm]
Silk To Silk Clearance Constraint: (0.228mm < 0.254mm) Between Text "D1" (34.1mm,13.1mm) on Top Overlay And Track (33.9mm,14.22mm)(33.9mm,17.12mm) on Top Overlay Silk Text to Silk Clearance [0.228mm]
Silk To Silk Clearance Constraint: (0.17mm < 0.254mm) Between Text "D1" (34.1mm,13.1mm) on Top Overlay And Track (33.9mm,14.22mm)(35.3mm,14.22mm) on Top Overlay Silk Text to Silk Clearance [0.17mm]
Silk To Silk Clearance Constraint: (0.25mm < 0.254mm) Between Text "GND1" (8.1mm,4.2mm) on Top Overlay And Text "TP8" (8.4mm,5.45mm) on Top Overlay Silk Text to Silk Clearance [0.25mm]
Silk To Silk Clearance Constraint: (0.237mm < 0.254mm) Between Text "GND2" (43.6mm,27.7mm) on Top Overlay And Text "M1" (47.2mm,26.65mm) on Top Overlay Silk Text to Silk Clearance [0.237mm]
Silk To Silk Clearance Constraint: (0.2mm < 0.254mm) Between Text "INN" (13.9mm,16.1mm) on Top Overlay And Text "TP2" (13.8mm,17.3mm) on Top Overlay Silk Text to Silk Clearance [0.2mm]
Silk To Silk Clearance Constraint: (0.242mm < 0.254mm) Between Text "M1" (47.2mm,26.65mm) on Top Overlay And Track (44.803mm,26.256mm)(50.667mm,26.256mm) on Top Overlay Silk Text to Silk Clearance [0.242mm]
Silk To Silk Clearance Constraint: (0.2mm < 0.254mm) Between Text "OUTL" (34.9mm,21mm) on Top Overlay And Text "TP5" (34.9mm,22.1mm) on Top Overlay Silk Text to Silk Clearance [0.2mm]
Silk To Silk Clearance Constraint: (0.109mm < 0.254mm) Between Text "OUTL" (34.9mm,21mm) on Top Overlay And Track (34.665mm,18.033mm)(34.665mm,22.681mm) on Top Overlay Silk Text to Silk Clearance [0.109mm]
Silk To Silk Clearance Constraint: (0.235mm < 0.254mm) Between Text "OUTL" (34.9mm,21mm) on Top Overlay And Track (38.193mm,19.051mm)(38.193mm,21.007mm) on Top Overlay Silk Text to Silk Clearance [0.235mm]
Silk To Silk Clearance Constraint: (0.235mm < 0.254mm) Between Text "OUTL" (34.9mm,21mm) on Top Overlay And Track (38.193mm,21.007mm)(42.841mm,21.007mm) on Top Overlay Silk Text to Silk Clearance [0.235mm]
Silk To Silk Clearance Constraint: (0.209mm < 0.254mm) Between Text "R1" (8.8mm,22mm) on Top Overlay And Track (10.335mm,20.159mm)(10.335mm,24.807mm) on Top Overlay Silk Text to Silk Clearance [0.209mm]
Silk To Silk Clearance Constraint: (0.209mm < 0.254mm) Between Text "R2" (8.5mm,16mm) on Top Overlay And Track (10.335mm,14.119mm)(10.335mm,18.767mm) on Top Overlay Silk Text to Silk Clearance [0.209mm]
Silk To Silk Clearance Constraint: (0.123mm < 0.254mm) Between Text "R2" (8.5mm,16mm) on Top Overlay And Track (8.2mm,11.2mm)(8.2mm,19.1mm) on Top Overlay Silk Text to Silk Clearance [0.123mm]
Silk To Silk Clearance Constraint: (0.194mm < 0.254mm) Between Text "TP5" (34.9mm,22.1mm) on Top Overlay And Track (32.709mm,22.681mm)(34.665mm,22.681mm) on Top Overlay Silk Text to Silk Clearance [0.194mm]
Silk To Silk Clearance Constraint: (0.194mm < 0.254mm) Between Text "TP5" (34.9mm,22.1mm) on Top Overlay And Track (34.665mm,18.033mm)(34.665mm,22.681mm) on Top Overlay Silk Text to Silk Clearance [0.194mm]
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Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All)
Height Constraint: Small Component M1-IRF620 (48mm,23.78mm) on Top Layer Actual Height = 25.95mm
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