Darlington Transistors | BSP52

NPN バイポーラ・ダーリントン・トランジスタ

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Overview

この NPN バイポーラ・ダーリントン・トランジスタは、プリント・ハンマ/リレー/ソレノイド/ランプ・ドライバなどのスイッチングアプリケーション向けに設計されています。このデバイスは、中電力の表面実装アプリケーション向けに設計された SOT-223 パッケージに収められています。

  • The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
  • Available in 12 mm Tape and Reel Use BSP52T1 to order the 7 inch/1000 unit reel Use BSP52T3 to order the 13 inch/4000 unit reel
  • PNP Complement is BSP62T1
  • Pb-Free Package is Available
  • S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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BSP52T1

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CAD Model

Pb

A

H

P

SOT-223-4 / TO-261-4D

0.0318

3

235

REEL

1000

N

NPN

1

80

1.3

2

-

-

Price N/A

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BSP52T1G

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CAD Model

Pb

A

H

P

SOT-223-4 / TO-261-4D

0.0318

1

260

REEL

1000

N

NPN

1

80

1.3

2

-

-

$0.1247

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BSP52T3G

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Active

CAD Model

Pb

A

H

P

SOT-223-4 / TO-261-4D

0.0318

1

260

REEL

4000

N

NPN

1

80

1.3

2

-

-

$0.1247

More Details

SBSP52T1G

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Active

CAD Model

Pb

A

H

P

SOT-223-4 / TO-261-4D

0.0318

1

260

REEL

1000

N

NPN

1

80

1.3

2

-

-

$0.1372

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信頼性データ

Die Related Summary Data

Device: BSP52T1G

Equivalent to wafer fab process: SST

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

SST

0

4654891639

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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