ESD Protection Diodes | ESD8551

高速データ回線用低容量 ESD 保護ダイオード

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Overview

技術資料および設計リソース データ・シート (1) パッケージ図面 (1)

  • USB 3.0
  • MHL 2.0
  • eSATA
  • Automotive Antennas
  • Solid State Drives
  • Low Capacitance (0.30 pF Max, I/O to GND)
  • Protection for the Following IEC Standards:IEC 61000−4−2 (Level 4)ISO10605 330 pF / 2 k? ±30 kV Contact
  • Low ESD Clamping Voltage
  • SZ Prefix for Automotive and Other Applications Requiring UniqueSite and Control Change Requirements; AEC−Q101 Qualified andPPAP Capable
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant
  • SZESD8551MXWT5G Wettable Flank Package

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ESD8551N2T5G

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CAD Model

Pb

A

H

P

X2DFN-2

714AB

1

260

REEL

8000

No

eSATA 2.0

USB 2.0

1

Bidirectional

0.3

5.5

3.3

0.05

-

1.00 x 0.60 x 0.37

$0.052

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SZESD8551MXWT5G

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CAD Model

Pb

A

H

P

X2DFNW2

711BG

1

260

REEL

8000

No

USB 2.0

1

Bidirectional

0.3

5.5

3.3

0.05

-

1.00 x 0.60 x 0.37

$0.0612

More Details

SZESD8551N2T5G

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Active

CAD Model

Pb

A

H

P

X2DFN-2

714AB

1

260

REEL

8000

No

USB 2.0

1

Bidirectional

0.3

5.5

3.3

0.05

-

1.00 x 0.60 x 0.37

$0.0572

More Details

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信頼性データ

Die Related Summary Data

Device: ESD8551N2T5G

Equivalent to wafer fab process: ZENER

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

ZENER

0

19743437079

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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