ESD Protection Diodes | ESDM3032

3.3 V 双方向マイクロパッケージ ESD 保護ダイオード

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Overview

ESDM3032 は、低容量が求められる電圧にセンシティブな部品を ESD および過渡電圧イベントから保護するために設計されています。優れたクランプ能力、低容量、低リーク、高速応答時間により、これらのパーツは基板スペースの節約が重要な設計での ESD 保護に最適です。

  • GPIO Protection
  • Audio Line Protection
  • SD Card Protection
  • SIM Card Protection

  • Smartphones
  • Wearables
  • Tablets
  • Notebooks
  • Laptops

  • High Peak Pulse current capability
  • Low Clamping voltage
  • 0201 Form Factor
  • IEC61000−4−2 Level 4 ESD Protection
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant

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V(BR) Min (V)

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Reference Price

ESDM3032MXT5G

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CAD Model

Pb

A

H

P

X3DFN-2

152AF

1

260

REEL

10000

N

Audio

SIM Card

1

Bidirectional

10

3.7

6.5

100nA

-

Price N/A

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信頼性データ

Die Related Summary Data

Device: ESDM3032MXT5G

Equivalent to wafer fab process: ZENER

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

ZENER

0

3462958625

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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