General Purpose and Low VCE(sat) Transistors | BCP68

(Legacy Fairchild) NPN バイポーラ・トランジスタ

Obsolete

Datasheet

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Overview

この NPN バイポーラ・トランジスタは低電圧高電流アプリケーション向けに設計されています。このデバイスは、中電力の表面実装アプリケーション向けに設計された SOT-223 パッケージに収められています。

  • High Current: IC = 1.0 Amp
  • The SOT-223 Package can be soldered using wave or reflow.
  • SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
  • Available in 12 mm Tape and Reel Use BCP68T1 to order the 7 inch/1000 unit reel. Use BCP68T3 to order the 13 inch/4000 unit reel.
  • The PNP Complement is BCP69T1
  • Pb-Free Packages are Available
  • S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Polarity

Type

VCE(sat) Max (V)

IC Cont. (A)

VCEO Min (V)

VCBO (V)

VEBO (V)

VBE(sat) (V)

VBE(on) (V)

hFE Min

hFE Max

fT Min (MHz)

PTM Max (W)

Reference Price

BCP68

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Obsolete

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CAD Model

Pb

A

H

P

SOT-223-4 / TO-261-4

318H-01

1

260

REEL

4000

N

NPN

General Purpose

0.5

1

20

30

5

-

1

85

375

-

1.5

Price N/A

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信頼性データ

Die Related Summary Data

Device: BCP68

Equivalent to wafer fab process: SST

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

SST

0

4654891639

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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