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コンパクトで効率的なデザインを目的として設計され、高い熱性能を備えた 5x6mm LFPAK デザインの産業用パワー MOSFET。
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製品:
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製品
状態
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channel Polarity
Silicon Family
Package Name
Type
Gate Level
Wide SOA Mosfets
Configuration
OPN in older Technology
V(BR)DSS Min (V)
RDS(on) Max @ VGS = 10 V (mΩ)
Vgs (V)
Vgs(th) Max (V)
ID Max (A)
PD Max (W)
RDS(on) Max @ VGS = 2.5 V (mΩ)
RDS(on) Max @ VGS = 4.5 V (mΩ)
Qg Typ @ VGS = 4.5 V (nC)
Qg Typ @ VGS = 10 V (nC)
Ciss Typ (pF)
Qgd Typ @ VGS = 4.5 V (nC)
Qrr Typ (nC)
Coss Typ (pF)
Crss Typ (pF)
Reference Price
NTMYS7D3N04CLTWG
Active
Pb
A
H
P
LFPAK-4
1
260
REEL
3000
Yes
N-Channel
PowerTrench® T6
Power 56 LFPAK
Low-Medium Voltage
Logic
0
Single
0
40
7.3
±20
2
52
3.8
-
12
7
16
860
-
11
360
15
$0.5128
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信頼性データ
Die Related Summary Data
Device: NTMYS7D3N04CLTWG
Equivalent to wafer fab process: TRENCH FET
製品技術
製品技術
等価デバイス時間
MTBF/MTTF (時間)
FITS
TRENCH FET
10
28017909861
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
