Small Signal MOSFETs | FDZ391P

-20V Pチャネル 1.5V PowerTrench® 薄型WL-CSP MOSFET

Obsolete

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Overview

最先端の「低ピッチ」薄型WLCSPパッケージングプロセスを使用し、フェアチャイルドの高度な1.5V PowerTrenchプロセスで設計されたFDZ391PはPCBスペースとRDS(ON)の両方を最小限に抑えます。 この高度なWLCSP MOSFETは、デバイスが優れた熱伝導特性、超低プロファイルパッケージ、少量のゲート電荷、および低RDS(ON)を組み合わせることができるパッケージング技術での飛躍的進歩により実現されています。

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  • Load Switch
  • Battery Protection

  • 最大 RDS(on) = 85 mΩ @ VGS = -4.5 V、ID = -1 A
  • 最大 RDS(on) = 123 mΩ @ VGS = -2.5 V、ID = -1 A
  • 最大 RDS(on) = 200 mΩ @ VGS = -1.5 V、ID = -1 A
  • PCB面積のわずか1.5mm2を占有
  • 超薄型パッケージ: プリント基板装着時、高さ0.4mm未満
  • RoHS対応

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

VGS Max (V)

Vgs(th) Max (V)

Id Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

FDZ391P

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Obsolete

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CAD Model

Pb

A

H

P

WLCSP-4

567PT

1

260

REEL

5000

N

P-Channel

PowerTrench® T1

NA

Small Signal

Logic

0

Single

0

-20

-

8

-1.5

-3

1.9

NA

123

17

9

NA

-

-

-

-

Price N/A

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信頼性データ

Die Related Summary Data

Device: FDZ391P

Equivalent to wafer fab process: TT

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

TT

6

2104831460

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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