Silicon Photomultipliers (SiPM) | ARRAYJ

シリコン・フォトマルチプライヤ・アレイ、Jシリーズ（SiPM）

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Overview

JシリーズSiPMセンサの高フィルファクタ・アレイ: オン・セミコンダクターのJシリーズ・シリコン・フォトマルチプライヤ（SiPM）センサは、高フィルファクタで拡張可能なアレイを作製するのに利用されてきています。TSVパッケージのセンサはPCBボードにマウントされていますが、デッド・スペースは最小限に抑えています。ArrayJ製品はさまざまな形式で提供されます。フォームのピクセルは3 mm、4 mm、6 mmです。ArrayJはいずれも背面にマルチウェイ・コネクタとBGA（ボール・グリッド・アレイ）のいずれかが1つ以上あるため、どのピクセルでも標準出力へのアクセスが可能で、場合によっては高速出力も可能です。

  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics

  • High fill-factor, scalable arrays
  • Variety of formats ranging from 2×2 to 8×8
  • Minimal deadspace, with fill factors of >90%
  • Each array as either a multi-way connector or BGA on the reverse for access to all signals
  • The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
  • The pixel-level performance is exactly as per that of the individual J-Series sensors
  • Optional evaluation boards are available for easy access to signals

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Case Outline

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MSL Temp (°C)

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Type

Array Format

Active Area Dimensions

Microcell Size (µm)

Optimized Wavelength (nm)

PDE @ Max Overvoltage (%)

DCR @ Typical Overvoltage (KHz/mm2)

Reference Price

ARRAYJ-30020-16P-PCB

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Active

CAD Model

Pb

A

H

P

ARRAYJ-300XX-16P-PCB

100DJ

1

260

UNTBX

1

Y

Array

4 x 4

3 mm x 3 mm

20

420

38

50

Price N/A

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ARRAYJ-30020-64P-PCB

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Active

CAD Model

Pb

A

H

P

ARRAYJ-300XX-64P-PCB

100DK

1

260

UNTBX

1

Y

Array

8 x 8

3 mm x 3 mm

20

420

38

50

Price N/A

More Details

ARRAYJ-30035-16P-PCB

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Active

CAD Model

Pb

A

H

P

ARRAYJ-300XX-16P-PCB

100DJ

1

260

UNTBX

1

Y

Array

4 x 4

3 mm x 3 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-30035-64P-PCB

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Active

CAD Model

Pb

A

H

P

ARRAYJ-300XX-64P-PCB

100DK

1

260

UNTBX

1

Y

Array

8 x 8

3 mm x 3 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-40035-64P-PCB

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CAD Model

Pb

A

H

P

ARRAYJ-400XX-64P-PCB

100DS

1

260

UNTBX

1

Y

Array

8 x 8

4 mm x 4 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-60035-4P-BGA

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CAD Model

Pb

A

H

P

ARRAYJ-600XX-4P

100DL

1

260

UNTBX

1

Y

Array

2 x 2

6 mm x 6 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-60035-4P-PCB

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Active

CAD Model

Pb

A

H

P

ARRAYJ-600XX-4P-PCB

100DP

1

260

UNTBX

1

Y

Array

2 x 2

6 mm x 6 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-60035-64P-PCB

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Active

CAD Model

Pb

A

H

P

ARRAYJ-600XX-64P-PCB

100DM

1

260

UNTBX

1

Y

Array

8 x 8

6 mm x 6 mm

35

420

50

50

Price N/A

More Details

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信頼性データ

Die Related Summary Data

Device: ARRAYJ-30020-16P-PCB

Equivalent to wafer fab process: CMOS SUB

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

CMOS SUB

2

920154574

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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