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11.7 No Joint Venture, Agency, etc. Nothing in this Agreement shall be construed as creating a joint venture, agency, partnership, trust or other similar association of any kind between the parties hereto. The parties hereto are for all purposes of this Agreement independent contractors, and neither shall hold itself out as having any authority to act as an agent or partner of the other party, or in any way bind or commit the other party to any obligations.

11.8 Interpretation. In this Agreement, words importing a singular number only shall include the plural and vice versa, and section numbers and headings are for convenience of reference only and shall not affect the construction or interpretation hereof.

11.9 Entire Agreement; Amendment; Counterparts; Facsimile Copies. This Agreement, including the Exhibits attached hereto, constitutes the entire agreement and understanding between the parties hereto regarding the subject matter hereof and supersedes all other agreements, understandings, promises, representations or discussions, written or oral, between the parties regarding the subject matter hereof. This Agreement may not be amended except in writing signed by an authorized representative of each of the parties hereto. This Agreement may be executed in counterparts, each of which shall be deemed to be an original, and which together shall constitute one and the same agreement. Each party hereto may deliver an executed copy of this Agreement to the other party via facsimile or other electronic means, and such executed copy(ies) sent/received via facsimile or other electronic means shall be deemed an original and binding copy.

12. Confidentiality. Notwithstanding any terms to the contrary in any non-disclosure agreements between the Parties, Licensee shall treat this Agreement and the Content as ON Semiconductor's "Confidential Information" including: not using the Confidential Information except as expressly set forth herein or otherwise authorized in writing; implementing reasonable procedures to prohibit the disclosure, unauthorized duplication, misuse or removal of the Confidential Information; and not disclosing the Confidential Information to any third party except as may be necessary and required in connection with the rights and obligations under this Agreement and subject to confidentiality obligations at least as protective as those set forth herein, or as otherwise required by law. It is expressly understood that all Confidential Information transferred hereunder, and all copies, modifications, and derivatives thereof, will remain the property of ON Semiconductor, and the Licensee is authorized to use those materials only in accordance with the terms and conditions of this Agreement. Upon termination of this Agreement or upon written request, License shall either return all Confidential Information to ON Semiconductor along with all copies and/or derivatives made, including that on computer databases and copies of portions of the Confidential Information, or destroy all such Confidential Information and certify by written memorandum that all such Confidential Information has been destroyed.

Nothing contained in this Agreement limits a party from filing a truthful complaint, or the party's ability to communicate directly to, or otherwise participate in either: (i) any investigation or proceeding with a United States government agency alleging a securities law violation, waste, fraud, or abuse; or (ii) an investigation or proceeding that is protected under a whistleblower provision of a U.S. federal law or regulation.

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オン・セミコンダクター、低電力 IoT 設計向け初のRFシステムインパッケージの世界最小レベルのSigfox認定ソリューションを発表 

ICのフォームファクターでモジュール同等の機能を備えた、デバイス・クラウド通信用のターンキーRFソリューションを実現するSigfox RC1認定のSiP

2017年9月26日(米国2017年9月25日発表):オン・セミコンダクター(本社 米国アリゾナ州フェニックス、Nasdaq: ON)は、先進のRFシステムオンチップ(SoC)と、TCXOを含むすべての周辺部品を統合した新しいプログラマブルRF トランシーバ・システムインパッケージ(SiP)を発表しました。新ソリューションAX-SIP-SFEUは、アップリンク(送信)およびダウンリンク(受信)の両方で最も高度に統合されたSigfoxソリューションを提供します。このデバイスは、今後数カ月以内に発売予定の新しいSiPファミリーの最初の製品で、モノのインターネット(IoT)接続を必要とするアプリケーションをサポートする包括的な使いやすいターンキー無線周波数(RF)ソリューションです。

多くのIoTアプリケーションは、センサの近くで接続を必要とするなど、厳しいスペース制約がありますが、オン・セミコンダクターの7 mm x 9 mm x 1 mm SiP受信機は約3分の1の面積で、モジュール型のソリューションの10分の1のサイズです。これにより、エンジニアは、はるかに大きな設計の自由を手に入れることができます。AX-SIP-SFEUには、AX-SFEU SoC ファミリー の成功を活かして必要なすべての機能が組み込まれており、これにより、オン・セミコンダクターは、Sigfoxアプリケーション向けのワンチップソリューション分野で市場をリードしていきます。このソリューションは、コンフォーマルシールドされ、電波規制に関する承認を事前に取得した状態で提供される「箱から出してすぐに使える」ソリューションです。そのため、お客様はアプリケーションとアンテナの設計に集中することができ、設計の簡素化、市場参入までの期間の短縮、全体的なコスト削減を実現できます。

バッテリー駆動のソリューションには長寿命が求められるため、無線通信アプリケーションに取り組む設計エンジニアのもう1つの懸念は消費電力です。Sigfoxの予測可能な最小の消費電力を特長とする「デバイス・ツー・クラウド」は、オン・セミコンダクターの新しいSiPベースの製品による超低電力設計を活用することにより、スタンバイモードでわずか0.5 ミリアンペア (mA)、スリープモードで1.3 マイクロアンペア (A)、ディープスリープモードで100 ナノアンペア (nA)の低消費電流を実現しています。

AX-SIP-SFEUは、シンプルな汎用非同期送受信(UART)インタフェースを介してお客様の製品に接続します。フレームの送信および無線パラメータの設定にはATコマンドが使用され、お客様が独自のソフトウェアを記述できるように、さまざまなバリエーションのアプリケーション・プログラミング・インタフェース(API)が用意されています。新しいデバイスは、ソフトウェア開発者向けの開発キットおよび統合IDEとともにオン・セミコンダクターのエコシステムの一部として構成されます。

オン・セミコンダクターのワイヤレス&コネクティビティ・ソリューション担当副社長であるトーマス・ウルフ(Thomas Wolff)は、次のように述べています。「オン・セミコンダクターの新しいSiPトランシーバの最初の製品であるAX-SIP-SFEUは、モジュールの利点、統合性、利便性をすべて備えつつ、ICのフォームファクターで供給されます。Sigfox認定を受け、現地の法規に準拠しています。このため、多くの市場にまたがる刺激的で革新的なIoTソリューションに取り組んでいるエンジニアは、既に対策済みとなっているコネクティビティとコミュニケーションの要素以外の設計に集中できます」

Sigfoxのグローバル・エコシステム・パートナーの副社長であるTony Francescaは、次のように述べています。「Sigfoxは、革新的な製品と先端の技術を当社のエコシステムにもたらしてくれるオン・セミコンダクターのようなパートナーがいることをうれしく思います。オン・セミコンダクターの新しいSiPは、新世代のデバイスを切り開き、高度な統合によりIoT市場が発展し、成熟していくことを立証しています」

チェコ・プラハで9月25日~26日に開かれる Sigfox World IoT Expo(ブース番号4) で本製品を展示します。

Twitter@onsemi_jpをフォローしてください。


オン・セミコンダクターについて
オン・セミコンダクター(Nasdaq: ON)は、お客様にグローバルな省エネルギーを実現していただけるよう、高効率エネルギーへのイノベーションをリードしてまいります。オン・セミコンダクターは半導体をベースにしたソリューションのリーディング・サプライヤーで、エネルギー効率の高い、電力管理、アナログ、センサ、ロジック、タイミング、コネクティビティ、ディスクリート、SoCおよびカスタム・デバイスの包括的なポートフォリオを提供しています。オン・セミコンダクターの製品は、自動車、通信、コンピューティング、民生機器、産業用機器、医療機器、航空宇宙、防衛のアプリケーションにおける特有な設計上の課題を解決します。オン・セミコンダクターは、北米、ヨーロッパ、およびアジア太平洋地域の主要市場で、製造工場、営業所、デザイン・センターのネットワークを運営しています。迅速な対応、信頼性、世界クラスのサプライ・チェーンと品質保証プログラム、厳格な企業倫理とコンプライアンスを備え、お客様のご要望にお応えしていきます。詳細については、http://www.onsemi.jpをご覧ください。

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オン・セミコンダクターおよびオン・セミコンダクターのロゴは、Semiconductor Components Industries, LLCの登録商標です。本ドキュメントに記載されている、それ以外のブランド名および製品名はすべて、各所有者の登録商標または商標です。オン・セミコンダクターは、本ニュースリリースで同社Webサイトを参照していますが、Webサイト上の情報はここには記載されていません。

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