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DO NOT DOWNLOAD, COPY, INSTALL, OR USE THIS CONTENT UNTIL YOU (THE "LICENSEE") HAVE CAREFULLY READ THE FOLLOWING TERMS AND CONDITIONS. BY DOWNLOADING, COPYING, INSTALLING, OR USING THE CONTENT, YOU AGREE TO THE TERMS OF THIS AGREEMENT. IF YOU DO NOT WISH TO SO AGREE, DO NOT DOWNLOAD, COPY, INSTALL, OR USE THE CONTENT.

If you agree to this Agreement on behalf of a company, you represent and warrant that you have authority to bind such company to this Agreement, and your agreement to these terms will be regarded as the agreement of such company. In that event, "Licensee" herein refers to such company. This Agreement is a legal contract between Licensee and Semiconductor Components Industries, LLC a Delaware limited liability company (d/b/a ON Semiconductor) having its principal place of business at 5005 E. McDowell Road, Phoenix, Arizona 85008, U.S.A., ("ON SEMICONDUCTOR") and its affiliates and subsidiaries ("ON Semiconductor").

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a) ON Semiconductor hereby grants to Licensee a fully paid-up, royalty-free, non-exclusive, non-transferable and non-sublicensable license to modify the Software as necessary to enable Licensee’s products ("Licensee Products") utilizing the Software to operate, or interface with only products sold to Licensee by or on behalf of ON Semiconductor ("ON Semiconductor Products").
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2.3 Restrictions. Except as expressly permitted in this Agreement, Licensee shall not use, modify, copy or distribute the Content or Modifications. The Content is the confidential information of ON Semiconductor (and/or its licensors/suppliers). Except as expressly permitted in this Agreement, Licensee shall not disclose, or allow access to, the Content or Modifications to any third party. Except as expressly permitted in this Agreement, Licensee shall not itself and shall restrict Customers from: copying, modifying, creating derivative work of, decompiling, disassembling or reverse-engineering the Content (or any part thereof).

2.4 Licensee acknowledges and agrees that Licensee is solely and wholly responsible and liable for any and all Modifications, Licensee Products, and any and all other products and/or services of Licensee, including without limitation, with respect to the installation, manufacturing, testing, distribution, use, support and/or maintenance of any of the foregoing.

3. Warranty Disclaimer. THE CONTENT IS PROVIDED BY ON SEMICONDUCTOR TO LICENSEE HEREUNDER "AS IS" AND WITHOUT ANY REPRESENTATIONS OR WARRANTIES WHATSOEVER. WITHOUT LIMITING THE FOREGOING, ON SEMICONDUCTOR (AND ITS LICENSORS/SUPPLIERS) HEREBY DISCLAIMS ANY AND ALL REPRESENTATIONS AND WARRANTIES IN RELATION TO THE CONTENT, ANY MODIFICATIONS, OR THIS AGREEMENT, WHETHER EXPRESS, IMPLIED, STATUTORY OR OTHERWISE,INCLUDING WITHOUT LIMITATION ANY AND ALL REPRESENTATIONS AND WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, NON-INFRINGEMENT, AND THOSE ARISING FROM A COURSE OF DEALING, TRADE USAGE, TRADE CUSTOM OR TRADE PRACTICE.

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5.2 Termination by ON Semiconductor. ON Semiconductor shall have the right to terminate this Agreement upon written notice to Licensee if: (i) Licensee commits a material breach of this Agreement and does not cure or remedy such breach within thirty (30) days after receipt of written notice of such breach from ON Semiconductor; or (ii) Licensee uses the Software outside of the scope of the Agreement; or iii) Licensee becomes the subject of a voluntary or involuntary petition in bankruptcy or any proceeding relating to insolvency, receivership, liquidation, or composition for the benefit of creditors if such petition or proceeding is not dismissed with prejudice within sixty (60) days after filing.

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9. Publicity. Licensee agrees that it shall not issue any press releases containing, nor advertise, reference, reproduce, use or display, ON Semiconductor's name or any ON Semiconductor trademark without ON Semiconductor's express prior written consent in each instance; provided, however, that Licensee may indicate that the Licensee Product is interoperable with ON Semiconductor Products in product documentation and collateral material for the Licensee Product.

10. Performance Comparisons. Licensee shall not distribute externally or disclose to any Customer or to any third party any reports or statements that directly compare the speed, functionality or other performance results or characteristics of the Software with any similar third party products without the express prior written consent of ON Semiconductor in each instance; provided, however, that Licensee may disclose such reports or statements to Licensee's consultants (i) that have a need to have access to such reports or statements for purposes of the license grant of this Agreement, and (ii) that have entered into a written confidentiality agreement with Licensee no less restrictive than that certain NDA.

11. Miscellaneous.

11.1 Governing Law. This Agreement shall be governed by the laws of the State of New York, and applicable U.S. federal law, without giving effect to conflict of law or to choice of law principles, and excluding the 1980 United Nations Convention on Contracts for the International Sale of Goods, if applicable.

11.2 Assignment. Neither this Agreement, nor any of the rights or obligations herein, may be assigned or transferred by Licensee without the express prior written consent of ON Semiconductor, and any attempt to do so in violation of the foregoing shall be null and void. Subject to the foregoing, this Agreement shall be binding upon and inure to the benefit of the parties, their successors and assigns.

11.3 Limitations on Use. The Software is not designed, developed, licensed or provided for use in connection with any nuclear facility, or in connection with the flight, navigation or communication of aircraft or ground support equipment, or in connection with military or medical equipment/applications or activities, or any other inherently dangerous or high risk equipment/applications or activities ("High Risk Use"). Licensee agrees that ON Semiconductor (and its licensors/suppliers) shall not be liable or responsible for any claims, losses, demands, costs, expenses or liabilities whatsoever arising from or in relation to any such High Risk Use of the Content, Software, Modifications or Licensee Products by Licensee or Customers.

11.4 Severability; Waiver. Any provision of this Agreement which is held to be invalid or unenforceable by a court in any jurisdiction shall, as to such jurisdiction, be severed from this Agreement and ineffective to the extent of such invalidity or unenforceability without invalidating the remaining portions hereof or affecting the validity or enforceability of such provision in any other jurisdiction. Failure by either party hereto to enforce any term of this Agreement shall not be held a waiver of such term nor prevent enforcement of such term thereafter, unless and to the extent expressly set forth in a writing signed by the party charged with such waiver.

11.5 Remedies Not Exclusive. The remedies herein are not exclusive, but rather are cumulative and in addition to all other remedies available to ON Semiconductor.

11.6 Records; Audit. Licensee agrees that it shall maintain accurate and complete records relating to its activities under Section 2.1(b)(iii) of this Agreement during the term of this Agreement. Upon reasonable advance written notice, ON Semiconductor shall have the right no more frequently than once in any 12 month period during the term of the Agreement, through an independent third party approved by Licensee in writing (such approval not to be unreasonably withheld), to examine and audit such records and Licensee's compliance with the terms of Section 2.1(b)(iii) of this Agreement. Any such audit shall not interfere with the ordinary business operations of Licensee and shall be conducted at the expense of ON Semiconductor. All reports, documents, materials and other information collected or prepared during an audit shall be deemed to be the confidential information of Licensee ("Licensee Confidential Information"), and ON Semiconductor shall protect the confidentiality of all Licensee Confidential Information; provided that, such Licensee Confidential Information shall not be disclosed to any third parties with the sole exception of the independent third party auditor approved by Licensee in writing, and its permitted use shall be restricted to the purposes of the audit rights described in this Section 11.6.

11.7 No Joint Venture, Agency, etc. Nothing in this Agreement shall be construed as creating a joint venture, agency, partnership, trust or other similar association of any kind between the parties hereto. The parties hereto are for all purposes of this Agreement independent contractors, and neither shall hold itself out as having any authority to act as an agent or partner of the other party, or in any way bind or commit the other party to any obligations.

11.8 Interpretation. In this Agreement, words importing a singular number only shall include the plural and vice versa, and section numbers and headings are for convenience of reference only and shall not affect the construction or interpretation hereof.

11.9 Entire Agreement; Amendment; Counterparts; Facsimile Copies. This Agreement, including the Exhibits attached hereto, constitutes the entire agreement and understanding between the parties hereto regarding the subject matter hereof and supersedes all other agreements, understandings, promises, representations or discussions, written or oral, between the parties regarding the subject matter hereof. This Agreement may not be amended except in writing signed by an authorized representative of each of the parties hereto. This Agreement may be executed in counterparts, each of which shall be deemed to be an original, and which together shall constitute one and the same agreement. Each party hereto may deliver an executed copy of this Agreement to the other party via facsimile or other electronic means, and such executed copy(ies) sent/received via facsimile or other electronic means shall be deemed an original and binding copy.

12. Confidentiality. Notwithstanding any terms to the contrary in any non-disclosure agreements between the Parties, Licensee shall treat this Agreement and the Content as ON Semiconductor's "Confidential Information" including: not using the Confidential Information except as expressly set forth herein or otherwise authorized in writing; implementing reasonable procedures to prohibit the disclosure, unauthorized duplication, misuse or removal of the Confidential Information; and not disclosing the Confidential Information to any third party except as may be necessary and required in connection with the rights and obligations under this Agreement and subject to confidentiality obligations at least as protective as those set forth herein, or as otherwise required by law. It is expressly understood that all Confidential Information transferred hereunder, and all copies, modifications, and derivatives thereof, will remain the property of ON Semiconductor, and the Licensee is authorized to use those materials only in accordance with the terms and conditions of this Agreement. Upon termination of this Agreement or upon written request, License shall either return all Confidential Information to ON Semiconductor along with all copies and/or derivatives made, including that on computer databases and copies of portions of the Confidential Information, or destroy all such Confidential Information and certify by written memorandum that all such Confidential Information has been destroyed.

Nothing contained in this Agreement limits a party from filing a truthful complaint, or the party's ability to communicate directly to, or otherwise participate in either: (i) any investigation or proceeding with a United States government agency alleging a securities law violation, waste, fraud, or abuse; or (ii) an investigation or proceeding that is protected under a whistleblower provision of a U.S. federal law or regulation.

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印刷

オン・セミコンダクター、フェアチャイルドセミコンダクター社を現金24億ドルで買収 

パワー半導体市場でグローバル・リーダーのポジションを確立















本契約の主なハイライト:
• パワー半導体市場のリーダーとなる幅広く奥深い製品ポートフォリオ
• 高・中・低電圧の全範囲をカバーする、高度に補完し合う製品ライン
• 主要な戦略領域である、産業・自動車・スマートフォン市場におけるプレゼンスの強化
• 非GAAPベースの1株当たり利益と純現金収支の急速な拡大
• 買収完了後の数四半期内における、非GAAPベースの1株当たり利益の大幅な増加
• 取引き終了後の18ヶ月以内で、年間1億5千万ドルのコスト削減の明確な見通し

高効率エネルギーへのイノベーションを推進するオン・セミコンダクター(本社 米国アリゾナ州フェニックス、Nasdaq: ON)とフェアチャイルドセミコンダクター・インターナショナル(NASDAQ:FCS、以下 フェアチャイルド)は、本日オン・セミコンダクターがフェアチャイルドを1株あたり20米ドル、総額でおよそ24億米ドルに相当する現金で買収することについて最終合意したと発表しました。この買収により、戦略的注力市場である自動車、産業、スマートフォンといった多様なエンド市場の全域にわたり、総額およそ50億米ドルの売上高を持つ、パワー半導体市場のリーダーとしてのポジションを確立します。(注1)

オン・セミコンダクターの社長兼CEOのキース・ジャクソン(Keith Jackson)は次のように述べています。「オン・セミコンダクターとフェアチャイルドの統合は、急速に集約されている半導体業界において、強力な能力を備えたパワー半導体のリーダーとしてのポジションを確立します。弊社の計画は、高・中・低電圧の全範囲をカバーする製品をお客様に提供するために、両社の補完的な製品ラインを集約することです。 一株当たり利益の急速な拡大とオン・セミコンダクターの純現金収支の大幅な向上の可能性は、フェアチャイルドの買収をオン・セミコンダクターの株主の皆様に向けた素晴らしい機会にします」

フェアチャイルドの会長兼CEOのマーク・トンプソン(Mark Thompson )は次のように語っています。「オン・セミコンダクターの一員として、フェアチャイルドはお客様の成功を支え、世界中のパートナーや社員から価値を引き出すために、今後も効率的なエネルギー消費における技術と設計のイノベーションのパイオニアとして存在し続けてまいります。私どもはスムーズな移行を実施するためにオン・セミコンダクターのチームと密に活動していきます」

取引完了の結果として、経常外の買収関連費用、逓増する在庫償却の適正額ならびに買収した無形資産減価償却を除いて、この買収がただちに売上増加につながると期待しています。オン・セミコンダクターの非GAAPベースの一株当たり利益と純現金収支の急速な増加が期待できます。オン・セミコンダクターは、本契約完了後の18ヶ月以内に年間1億5千万米ドルのコスト削減を達成することを予測しています。

本契約は財務状況に左右されるものではありません。オン・セミコンダクターは、統合された両社の貸借対照表と24億米ドルの新たな借り入れによる現金でこの契約に資金供給する予定です。この資金調達の約定には、融資契約の完了時点では資金引き出しが行われていない3億米ドルのリボルビング信用枠の規定も含まれます。オン・セミコンダクターは、株式買戻しプログラムに引き続き注力し、また資金調達の合意条項には今後の株式買戻しの継続についての柔軟性を含んでいます。

(注1) 売上高50億ドルは両社の過去12か月における売上高に基づいています。

公開買い付けと完了
この最終合意条件に基づき、オン・セミコンダクターは、フェアチャイルドの発行済み普通株式を1株あたり20米ドルで買いとり各株主に現金で支払うするための株式公開買い付けを開始します。必要な規制当局の承認を受け、その他の慣習的な完了条件を満たし、公開買い付けにおいて応札された全株式に対する支払いが承認された時点以降に、実行可能なかぎり迅速にこの最終合意による両社の合併が行われます。これにより、公開買い付けに応札されていない全株式は1株あたり20米ドルを現金で受け取る権利に変換されます。本取引はオン・セミコンダクターとフェアチャイルドの取締役会で全会一致で承認されており、2016年第2四半期後期の完了を予想しています。この提案された取引に関して、オン・セミコンダクターの株主の承認は必要とされません。

ドイツ銀行(Deutsche Bank)がオン・セミコンダクターの幹事財務顧問です。モリソン・フォースター(Morrison & Foerster)はオン・セミコンダクターの法律顧問、バンクオブアメリカ・メリルリンチ(BofA Merrill Lynch)もオン・セミコンダクターの財務顧問を担当します。ドイツ銀行とバンクオブアメリカ・メリルリンチは、本取引に対する資金調達を確約しています。ゴールドマン・サックス(Goldman Sachs)はフェアチャイルドの専任財務顧問を、法律顧問担当のワクテル・リプトン・ローゼン・アンド・カッツ(Wachtell, Lipton, Rosen & Katz )とともに務めました。

オン・セミコンダクターについて
オン・セミコンダクター(Nasdaq: ON)は、お客様にグローバルな省エネルギーを実現していただけるよう、エネルギー効率のイノベーションをリードしてまいります。オン・セミコンダクターのエネルギー効率の高い、パワー&信号制御、ロジック、ディスクリートおよびカスタム・ソリューションの包括的なポートフォリオは、自動車、通信、コンピューティング、民生機器、産業用機器、LED 照明、医療機器、軍事/航空宇宙および電源アプリケーションにおける特有な設計上の課題を解決します。オン・セミコンダクターは、北米、ヨーロッパ、およびアジア太平洋地域の主要市場で、対応力、信頼性に優れた、世界クラスのサプライ・チェーンと品質保証体制、および製造工場、営業所、デザイン・センターのネットワークを稼働させています。詳細については、http://www.onsemi.jp をご覧ください。

オン・セミコンダクターおよびオン・セミコンダクターのロゴは、Semiconductor Components Industries, LLCの登録商標です。本ドキュメントに記載されている、それ以外のブランド名および製品名はすべて、各所有者の登録商標または商標です。オン・セミコンダクターは、本ニュース・リリースで同社Webサイトを参照していますが、Webサイト上の情報はここには記載されていません。

フェアチャイルドセミコンダクターについて
フェアチャイルドセミコンダクター(NASDAQ: FCS)は、世界規模の展開とローカルなサポート、優れたアイデアを提供しています。フェアチャイルドはパワーとモバイル設計に向けた、エネルギー効率に優れた、使いやすく付加価値の高い半導体ソリューションを供給します。フェアチャイルドのパワーとシグナルパス製品における専門知識により、お客様の製品の差別化と困難な技術的課題の解決をサポートします。詳細はウェブ www.fairchildsemi.com (日本語 www.fairchildsemi.co.jp)をご覧ください。

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Cautions regarding Forward-Looking Statements
This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, but are not limited to, statements related to the consummation and benefits of the acquisition by ON Semiconductor Corporation (“ON Semiconductor”) of Fairchild Semiconductor (“Fairchild”) and the future financial performance of ON Semiconductor. These forward-looking statements are based on information available to us as of the date of this release and current expectations, forecasts and assumptions and involve a number of risks and uncertainties that could cause actual results to differ materially from those anticipated by these forward-looking statements. Such risks and uncertainties include a variety of factors, some of which are beyond our control. In particular, such risks and uncertainties include, but are not limited to,: the risk that one or more closing conditions to the transaction may not be satisfied or waived, on a timely basis or otherwise; the unsuccessful completion of the tender offer; the risk that the transaction does not close when anticipated, or at all, including the risk that the requisite regulatory approvals may not be obtained; matters arising in connection with the parties’ efforts to comply with and satisfy applicable regulatory approvals and closing conditions relating to the transaction; there may be a material adverse change of us or Fairchild or our respective businesses may suffer as a result of uncertainty surrounding the transaction; the transaction may involve unexpected costs, liabilities or delays; difficulties encountered in integrating Fairchild, including the potentially accretive and synergistic benefits; difficulties leveraging desired growth opportunities and markets; the possibility that expected benefits and cost savings may not materialize as expected; the prospect that the automotive and industrial sensor markets will not grow as rapidly as currently anticipated; the variable demand and the aggressive pricing environment for semiconductor products; the adverse impact of competitive product announcements; revenues and operating performance; changes in overall economic conditions and markets, including the current credit markets; the cyclical nature of the semiconductor industry; changes in demand for our products; changes in inventories at customers and distributors; technological and product development risks; availability of raw materials; competitors' actions; pricing and gross margin pressures; loss of key customers; order cancellations or reduced bookings; changes in manufacturing yields; control of costs and expenses; significant litigation, including with respect to intellectual property matters; risks associated with acquisitions and dispositions; risks associated with leverage and restrictive covenants in debt agreements; risks associated with international operations including foreign employment and labor matters associated with unions and collective bargaining agreements; the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally; changes in generally accepted accounting principles; risks related to new legal requirements; risks and costs associated with increased and new regulation of corporate governance and disclosure standards; and risks involving environmental or other governmental regulation. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON Semiconductor’s Annual Report on Form 10-K, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K and other of ON Semiconductor’s filings with the Securities and Exchange Commission. These forward-looking statements are as of the date hereof and should not be relied upon as representing our views as of any subsequent date, and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made. For additional information, visit ON Semiconductor’s corporate website, www.onsemi.com, or for official filings visit the SEC website, www.sec.gov.

Notice to Investors
The tender offer for the outstanding shares of common stock of Fairchild has not yet commenced. This press release is for informational purposes only, and it does not constitute an offer to purchase or a solicitation of an offer to sell any securities. At the time the tender offer is commenced, ON Semiconductor and a wholly-owned subsidiary of ON Semiconductor will file a tender offer statement on Schedule TO with the Securities and Exchange Commission (“SEC”), and Fairchild will file a solicitation/recommendation statement on Schedule 14D-9 with respect to the tender offer. The tender offer statement (including an offer to purchase, a related letter of transmittal and other offer documents) and the solicitation/recommendation statement will contain important information that should be read carefully before any decision is made with respect to the tender offer. INVESTORS AND SECURITY HOLDERS OF FAIRCHILD ARE URGED TO READ THESE AND OTHER DOCUMENTS FILED WITH THE SEC CAREFULLY IN THEIR ENTIRETY WHEN THEY BECOME AVAILABLE BECAUSE THEY WILL CONTAIN IMPORTANT INFORMATION ABOUT THE PROPOSED TRANSACTION. Such materials will be made available to Fairchild’s stockholders at no expense to them. In addition, such materials (and all other offer documents filed with the SEC) will be available at no charge on the SEC website: www.sec.gov.