The Architecture Behind the Future of Power Density

The Embedded Power Platform (EPP) is an industry-first power device integration and packaging platform that reimagines power delivery from the die to the system level. By bringing electrical, thermal, and mechanical optimization together within a single architecture, EPP enables a highly integrated approach to power system design. Unlike traditional power modules, EPP enables multiple semiconductor die to be embedded directly within a silicon wafer-level architecture - transforming the package itself into a key enabler of electrical and thermal performance and blurring the boundary between semiconductor and package.

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What Makes EPP Different?

The EPP Architecture

  • Embeds multiple semiconductor devices directly into a silicon-based platform
  • Replaces wire bonds with wafer-level redistribution layers (RDLs), reducing parasitics and improving electrical performance
  • Wafer-level integration applies the precision of semiconductor manufacturing to the system-level design
  • Brings power, control, and isolation functions together within a common architecture
  • Supports current and future generations of silicon, SiC, GaN and emerging power semiconductor technologies

Together, these capabilities create a scalable, technology-agnostic platform that supports rapid design iteration while reducing development complexity across power levels and applications.

Key Advantages of Embedded Power Platform

System-Level Co-Optimization

Electrical, thermal, and mechanical performance are designed together from the outset.

Higher Power Density

Co-optimized design delivers up to 4x improved power density.

Electrical & Thermal Performance

Low parasitics and efficient thermal pathways improve system performance.

Integrated by Design

Power switches, controllers, drivers and isolators can be combined within a compact architecture.

Accelerated Innovation

System-level co-optimization reduces design complexities and development cycles.

Scalable Platform

Supports multiple semiconductor technologies, power levels, and future applications.

From Concept to Breakthrough

Go inside East Fishkill, NY onsemi manufacturing and innovation center and hear from company leadership and the technical experts behind the Embedded Power Platform. Discover the challenges shaping the future of power delivery and how this breakthrough platform is designed to solve them.

Core Applications

AI Infrastructure

Power delivery hardware occupies valuable board space, generates heat, and can limit compute density. EPP enables smaller, more thermally efficient power architectures designed to support the growing demands of AI infrastructure.

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Electric Vehicles

As automotive power demands grow, automakers need more efficient and scalable traction inverter architectures. EPP enables smaller, lighter, and system-optimized solutions while supporting common platform designs that scale across vehicle programs and power levels.

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Charging Infrastructure

The transition to faster charging and higher power requires conversion systems that deliver more power in smaller footprints with higher efficiency. EPP supports highly integrated charging architectures through improved thermal performance, reduced electrical losses, and increased power density.

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Renewable Energy

The growth of diversified, renewable and storable energy is increasing demand for more efficient power conversion systems. EPP supports next-generation solar inverters and energy storage systems through a scalable architecture designed to improve efficiency, thermal performance, and system integration.

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Industrial Automation

Industrial power systems must deliver higher performance while minimizing size, complexity, and cost. EPP enables more integrated and scalable power architectures that help improve efficiency, simplify system design, and support future generations of industrial equipment.

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