High‑Efficiency Gallium
Nitride for Modern Power Systems

GaNEXUS™ is onsemi’s gallium nitride (GaN) power portfolio, designed to deliver higher efficiency, greater power density, and fast switching performance across modern power architectures. GaNEXUS applies GaN where it creates the greatest system level impact by supporting compact, efficient power conversion from source to load.

With proven power design, exceptional quality, and lifecycle support, GaNEXUS helps customers build reliable, scalable solutions for applications including AI data centers, robotics and automation, automotive power systems, and energy infrastructure.

Key Advantages of GaNEXUS™

Higher Power Density

Smaller magnetics, compact designs, greater integration.

High Frequency Performance

Faster switching for advanced conversion stages.

Made for Deployment-Ready Systems

Designed for long lifecycle, production scale power.

Built on onsemi Reliability

Wide bandgap expertise, exceptional quality, automotive-grade and beyond qualification, lifecycle support.

Intelligent Power Ecosystem

Treo Platform’s GaN‑optimized drivers and power management ICs enable simpler, smarter GaN system design.

Scalable Voltage Range

GaN solutions spanning low- to high-voltage, 40 – 1200V, including vertical GaN power.

GaN Power Architecture

Power conversion happens in stages, from high‑voltage distribution to point‑of‑load regulation. GaNEXUS applies gallium nitride where higher switching frequency, power density, and efficiency unlock meaningful system‑level benefits.

GaN Power Architecture Diagram showing GaN power conversion stages including source and distribution, high frequency conversion, intermediate conversion, point of load, and end system. AC grid / battery / HV DC PFC / LLC / HV DC-DC IBC / DC-DC Intermediate
Conversion POL / Motor drive / 
Load Regulation POL / Motor drive / 
Load Regulation Point-of-Load / Actuation End System Source/Distribution
(Front-end) High-Frequency
Conversion

Key Stages Where GaNEXUS Applies:

High Frequency Conversion Stages

  • Compact, efficient conversion
  • Reduced magnetics and thermal stress
  • Enables higher system density

Intermediate Power Conversion

  • Balances efficiency, scalability, and dynamic response
  • Supports evolving architectures and distribution schemes

Power Close to the Load

  • Fast transient response
  • Smaller power stages near processors, motors, or loads
  • Improved system responsiveness

Motion & Actuation Power

  • Efficient switching for compact drives
  • Thermal benefits in space constrained systems
  • Precision and responsiveness

Core End Applications

AI Data Center & Cloud Infrastructure

AI and cloud power systems demand high-density, high-frequency conversion across multiple stages. Low and medium voltage GaN FETs (40–200 V) enable compact intermediate and point-of-load power, while high-voltage GaN FETs (650 V and beyond) support efficient isolated conversion. Bidirectional and integrated GaN enable scalable, next-generation data center architectures – from grid to GPU.

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Physical AI, Robotics & Industrial Power

Robotic and automated systems require compact, efficient power with precise motion control. Low and medium voltage GaN FETs enable high frequency motor drive and servo stages that reduce size and losses. Integrated GaN drive and smart solutions simplify design by adding protection and control, supporting responsive, reliable robotic platforms.

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Energy Infrastructure

Energy and industrial systems require efficient, high‑reliability power over long lifecycles. High‑voltage and future ultra‑high‑voltage GaN FETs enable compact, high‑frequency conversion where efficiency and size matter most. Smart and controlled GaN solutions add protection and monitoring to simplify design and enhance system robustness.

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Automotive Electrification

Automotive power architectures span multiple voltage domains, from auxiliary and 48 V systems to electrified subsystems. Low and medium voltage GaN FETs support compact DC DC conversion, while high voltage GaN solutions enable efficient isolated power stages. Bi-directional and integrated GaN support emerging vehicle architectures with improved efficiency and system integration.

View Automotive Solutions

GaNEXUS Product Portfolio

Discover products built on the Galium Nitride portfolio.

Low / Medium Voltage GaNEXUS FETs

High frequency 40-200V GaN HEMTs for IBC, POL, motor drive stages

High Voltage GaNEXUS FETs

650V compact, efficient GaN HEMTs for high frequency, isolated conversion

GaNEXUS Smart

GaN HEMTs with integrated protection and sensing

GaNEXUS BDS (Bidirectional Switches)

Monolithic bidirectional GaN for advanced power architectures

GaNEXUS Drive

GaN HEMTs with integrated gate drive functionality

GaNEXUS Control

GaN power stages with embedded control

Power Architecture Guide

Get a practical guide to designing modern power systems with GaNEXUS—covering architectures, technology tradeoffs, and where GaN delivers the most value.

Power Systems Require Multiple Technologies

GaNEXUS is designed to work seamlessly with onsemi’s broader power portfolio, offering gallium nitride across discrete, bidirectional, and integrated power solutions, alongside advanced silicon power solutions and EliteSiC™ silicon carbide, deployed where each technology delivers the greatest system‑level benefit and optimal trade-offs. Together with Treo Platform™ power ICs for gate drive, protection, and power management, onsemi helps customers design complete power architectures from source to load optimized for performance, efficiency, and reliability. Explore our other technologies:

FAQs

View most frequently asked questions about Gallium Nitride (GaN) technology.

Gallium nitride (GaN) is a wide bandgap semiconductor with lower resistance to current flow, that enables at application level, higher switching frequency, greater power density, and improved efficiency compared to traditional silicon power devices. These characteristics allow designers to reduce magnetics size, improve thermal performance, and enable more compact, efficient power systems across a wide range of applications.

GaN delivers the greatest system level value in high frequency, power density driven conversion stages, where switching speed and efficiency directly impact system size and thermal performance. These stages commonly include intermediate bus conversion (IBC), isolated DC-DC conversion, point-of-load (PoL) regulation, and motor drive and actuation stages. In lower frequency or very high power front end stages, other technologies may be more appropriate. These power conversion stages appear across many systems. In AI data centers and cloud infrastructure, GaN enables dense, fast responding power delivery for advanced compute. In robotics and industrial automation, GaN improves efficiency and compactness in motor drives and actuation stages. In automotive power systems, GaN supports high density auxiliary and DC DC conversion across multiple voltage domains. In energy infrastructure and industrial power, GaN enables more compact and efficient high frequency isolated conversion.

Gallium nitride power technology supports a broad voltage range through two main device architectures: lateral GaN and vertical GaN. Lateral GaN devices are commonly used from approximately 30 V up to 650 V, and in some designs approaching 900 V, making them well suited for high-frequency, high-density conversion stages such as DC DC, isolated DC DC, and motor drives. Vertical GaN extends GaN capability into ultra high-voltage domains – typically above 900 V and beyond 1200 V. With it’s unique structure of GaN grown on top of GaN substrate, vertical GaN improves scalability and robustness for advanced high voltage power architectures. The GaNEXUS™ portfolio span this full GaN voltage spectrum, from low , medium- and high voltage lateral GaN FETs to ultra-high-voltage vertical GaN, allowing GaN to be applied where it delivers the greatest system level benefit.

GaN, silicon, and silicon carbide (SiC) each excel in different parts of a power architecture. Silicon remains cost-effective and efficient for lower-frequency and lower- power applications. SiC is well suited for high-voltage, high-power front-end conversion, where efficiency and robustness are critical. GaN excels in applications that benefit from high switching frequency and power density, enabling smaller, more compact designs. Modern power systems often combine all three technologies, optimized by stage rather than replaced wholesale.

Bidirectional GaN devices allow power to flow efficiently in both directions using a single device structure, rather than back-to-back unidirectional switches. This can reduce component count, switching losses, and system complexity. Bidirectional GaN is particularly valuable in applications such as energy storage systems, automotive DC DC “Matrix” conversion and T-type traction inverter, advanced data-center power architectures, and many AC/DC or DC/DC systems that require efficient two-way energy flow.

Integrated GaN power devices combine GaN transistors with additional functions such as gate drive, protection, sensing, or control in a single device. Integration can simplify and accelerate board design, improve reliability, and enhance system level performance by reducing parasitic and control complexity. GaNEXUS integrated power – such as Drive, Smart, and Control devices – are designed to support this increasing level of power integration over time.

GaNEXUS applies GaN with a focus on deployment-ready power systems, addressing not only performance but also reliability, manufacturability, and lifecycle support. Built on onsemi’s wide-bandgap leadership and expertise, and multi-source manufacturing, GaNEXUS solutions are engineered with qualification rigor, long-term availability, and robustness—helping customers adopt GaN with confidence.

onsemi’s gallium nitride portfolio, GaNEXUS, is designed to support production ready GaN adoption across modern power architectures. GaNEXUS spans low to ultra high voltage GaN technologies, including lateral and vertical GaN, and extends beyond discrete switching devices to include bidirectional GaN and integrated GaN power architectures. What differentiates onsemi’s GaN approach is the system level focus – combining GaN power devices with GaN optimized gate drive, mixed-signal Treo Platform power management ICs, protection, sensing, and control, and designing GaN solutions to work alongside silicon and silicon carbide where each technology delivers the greatest system level benefit. This enables scalable, interoperable, and reliable power designs suitable for high-volume, long lifecycle applications.