Reliability Data - Device MTBF/MTTF/FIT

Device: NCD98010XMXTAG
Equivalent to wafer fab process: ONC18

Die Related Summary Data

製品技術

リジェクト

等価デバイス時間

MTBF/MTTF (時間)

FITS

ONC18 2

Data is based on the following assumptions:

Activation Energy (constant) 0.7 electron-volts
Junction Temperature (25 - 175) Celsius
One-sided Upper Confidence Level percent

Note: The temperature and confidence level may be adjusted to your requirements.
Click the 'Calculate' button when set.

Disclaimer:
A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard), onsemi can calculate the raw FIT rate according to generic standards (IEC62380, IEC61709, SN29500, FIDES, etc.) or provide, when available, functional safety related documentation to allow for the integration of the components into the system. Support can be requested by sending an email to JIRA.GFSM@onsemi.com.

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